NPI Process Development Engineer

NXP Malaysia

Posted on : 27-08-2025

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1 Vacancy

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Job Location

Kuala Lumpur - Malaysia

Monthly Salary

Not Disclosed

Salary Not Disclosed

Vacancy

1 Vacancy

Posted on : 27-08-2025

Job Description

Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.

Responsible for quality yield cost and process improvement activities.

Responsible for process documentation process spec standard work instruction OCAP QIT etc.

Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.

Take ownership to work closely with upper management to align scope and direction of key projects.

Requirements:

7-10 years of work experience with semiconductor assembly background for automotive customers.

Experience in LQFP MAPBGA SiP FCCSP FCBGA etc. packing development will be an added advantage.

Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing plasma dicing mechanical saw die bond wire bonding mold ball attach marking singulation etc.

Candidate must have great interpersonal skills leadership skills result orientated self-driven and eager to strive for success.

Good SPC Process Control and other relevant statistical & problem-solving skills

Good in Microsoft application (PowerPoint Excel Macro Word etc.). Project Management knowledge is an added advantage.

More information about NXP in Malaysia...

#LI-633a

Employment Type

Full-Time

Company Industry

Key Skills

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About Company

NXP Malaysia

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NPI Process Development Engineer

NXP Malaysia

Job Description

Employment Type

Company Industry

Key Skills

About Company

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