Sr / Principal Engineer, Advance Packaging Process Engineering

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity sustainability and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.

Microns Assembly Package Technology Development team is looking for a motivated and experienced individual contributor for this position in Process Development team.

A good candidate will be developing configuring and optimizing Package Assembly processes (front end bonding and back end) for Microns memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams.

Assessing processes by knowledge and skills taking measurements and interpreting data are everyday responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assembly design rules development working side by side with Design teams (Globally) and you will be involved in the design approvals (Substrate and Silicon) running testing and upgrading systems and processes approving the materials process and equipment changes in the CCB (change control board).

An important topic is the path finding of innovative package technology: Deep fundamental understanding of the key risks in Photo/Etch/Bumping/WetPVD/CVD WSS (Wafer Support System) Thermal Compression Bonding/Flip chip and HBM technologies.

Finally the hands-on integration experience in Wafer Fabrication or Wafer Level package process are needed may need to conduct the supplier interactions/meetings and drive new NDAs with new projects which all together requires a significant understanding of the processes first principles and process control systems.

Ensure smooth transition from new process development 1st qualification success to small volume production launch

• Development and Qualification of new packaging process material equipment and technology solutions to meet new Technode (NPI) requirements and schedule
• Perform process TRA risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.
• Lead/collaborate with cross function team/site to ensure successful transfer to NPI & HVM.
• Qualify new process/technology/equipment/materials
• Implement PMI (Process Maturity Index) methodology & provide proper Documentation for product transfer CEM & HVM

Technical capability

• Identify path finding opportunities for continuous yield improvement and cost reduction activities
• To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process
• Understand the future trend technology and capabilities required for future packaging solutions work with teams to put in place new capabilities to enhance process performance.

Provide new solutions on time to meet company and customer needs

• Define develop and establish process capabilities strategy and roadmap
• To develop & engage creative solutions for new capabilities or to overcome the identified process constraints ahead product requirements.

Requirements

• Bachelors or Masters degree in Electrical Engineering Materials Science Physics or related field.
• Minimum of 3 years of experience in Wafer Fabrication or Wafer Level package process (Photo/Etch/Bumping/Wet/PVD/CVD WSS (Wafer Support System) Thermal Compression Bonding/Flip chip and HBM technologies)
• Minimum of 3 years of experience in semiconductor manufacturing or related fields.
• Proven track record in yield management and driving yield improvement initiatives.
• Deep understanding of semiconductor manufacturing processes yield analysis and statistical process control (SPC).
• Hands-on experience with data analysis tools such as JMP or equivalent.
• Strong communication skills and able to present complex technical data and trends to leadership and non-technical audiences.
• Proven ability to work with multi-functional teams and influence partners to achieve strategic goals.
• Problem-Solving Skills: Strong analytical skills with the ability to troubleshoot and resolve complex technical issues in a high-pressure environment.
• Project Management: Ability to manage numerous projects simultaneously and prioritize tasks in a fast-paced environment.
• Cross-Cultural Communication: Experience working with teams across different geographies and cultures.

About Micron Technology Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.

To learn more please visit qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation gender identity national origin veteran or disability status.

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Micron Prohibits the use of child labor and complies with all applicable laws rules regulations and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.