Principal Etch Process Engineer

Singapore - Singapore

Monthly Salary: Not Disclosed

Posted on: 30+ days ago

Vacancies: 1 Vacancy

Job Summary

We are looking for Process Engineer role in preparation for the formation of the joint venture of NXP and VIS known as VSMC.

Job Description

This posting is for a Principal Etch Process Engineer in a high volume 300mm wafer manufacturing environment. The Senior Deep Trench Etch Engineer is responsible for the optimization and sustaining of deep trench etch processes used in advanced semiconductor device fabrication. This role involves working with plasma etch tools driving process improvements and collaborating with cross-functional teams to ensure high yield reliability and manufacturability of deep trench structures.

Primary Responsibilities:

Develop and optimize deep trench etch processes for silicon and compound semiconductor substrates. Characterize etch profiles selectivity and uniformity using SEM profilometry and other metrology tools.
Maintain upgrade and monitor wafer fabrication equipment in the Etch process area. Troubleshoot process issues and implement corrective actions to improve yield and reduce defects.
Collaborate with integration device Manufacturing Maintenance and Process teams to improve overall etch performance.
Lead DOE (Design of Experiments) and SPC (Statistical Process Control) initiatives for process stability.
Monitor statistical process control for high volume manufacturing equipment.
Participate in and/or lead cross-functional and lean activity teams.
Reduce defectivity mechanisms and improve process control
Work with minimal supervision balancing competing priorities to serve the needs of the engineering and manufacturing communities
Drive equipment performance to maximize capacity and yield performance.
Improve cost performance of equipment.
Mentor engineers and provide technical leadership in Etch process improvement.

Required Skills/Experience:

B.S. Degree in Electrical Engineering Materials Science Solid State Physics or other relevant engineering discipline is required.
Minimum 15 years semiconductor Etch process engineering experience is required.
Experience in Lean Manufacturing a plus
Knowledge of Semiconductor Manufacturing a plus
Ability to deal with multiple issues and shifting priorities
Strong verbal and written communication skills
Ability to interact with multiple disciplines in a 7x24 manufacturing facility
Good problem solving skills
Self-motivated; able to take initiative
Excellent interpersonal skills
Competency in troubleshooting problems

More information about NXP in Singapore...

#LI-2370

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Staff IC

We are looking for Process Engineer role in preparation for the formation of the joint venture of NXP and VIS known as VSMC.Job DescriptionThis posting is for a Principal Etch Process Engineer in a high volume 300mm wafer manufacturing environment. The Senior Deep Trench Etch Engineer is responsible...