Fellow Engineering42
Fellow Engineering42
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Job Description
What you do at AMD changes everything
At AMD we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in highperformance computing graphics and visualization technologies building blocks for gaming immersive platforms and the data center.
Developing great technology takes more than talent: it takes amazing people who understand collaboration respect and who will go the extra mile to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo push boundaries deliver innovation and change the world. If you have this type of passion we invite you to take a look at the opportunities available to come join our team.
Packaging Engineering Fellow
What you do at AMD changes everything
At AMD we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in highperformance computing graphics and visualization technologies building blocks for gaming immersive platforms and the data center.
Developing great technology takes more than talent: it takes amazing people who understand collaboration respect and who will go the extra mile to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo push boundaries deliver innovation and change the world. If you have this type of passion we invite you to take a look at the opportunities available to come join our team.
The Role
As a member of AMDs Advanced Packaging team you will drive new 3D advanced packaging technology development and establish proof of concept that is HVM scalable with the ecosystem partners to support new AMD products. You will also be active in researching new tools materials working with Universities and consortia to drive the next big thing in 3D interconnects.
The Person
- The candidate should have a proven track record and extensive knowledge and experience in Wafer Level Process Integration BEOL Integration 2.5D/3D integration with TSV Hybrid Bonding etc.
- He/she should have a handson approach to new process development as well as excellent oral and written communication skills to communicate ideas with Technology Partners Colleagues Product Architects and AMD Management.
Key Responsibilities
- Develop and prototype cutting edge advanced 3D packaging technologies for AMD products.
- Partner with AMD architects designers and product owners to develop high yielding costeffective solutions which meet product requirements.
- Enable development partners in the AMD supply chain to develop and demonstrate these concepts in low volume.
- Partner with Product teams and Manufacturing Engineering to demonstrate reliability and smoothly transition new packaging technologies from concept through NPI.
Preferred Experience
- Fundamental knowledge and hands on experience in BEOL technologies TSV integration 2.5D/3D integration Hybrid bonding technologies.
- Good knowledge in design and reliability such as TV design CPI Thermomechanical analysis DFR/DFM etc.
- Familiarity with Advanced Packaging Techniques including fanout 3D stacking 2.5D and MCM packaging techniques for improved functionality at the lowest cost.
Extensive experience driving innovative advanced silicon and/or packaging
Academic Credentials
- BS/MS/PhD in Computer Science Applied Mathematics Electrical Engineering Mechanical Engineering. Materials science and engineering or equivalent.
AMD does not accept unsolicited resumes from headhunters recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age ancestry color marital status medical condition mental or physical disability national origin race religion political and/or third party affiliation sex pregnancy sexual orientation gender identity military or veteran status. Please clickherefor more information.
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Requisition Number:170942
Country/Region/Location:IndiaState/Province:KarnatakaCity:Bangalore
Job Function:Other Engineering
Employment Type
Full-Time
