Silicon Chip Lead First Pass Silicon Expertise

Job Description: Silicon Chip Lead (First Pass Silicon Expertise)

Position Title: Silicon Chip Lead

Location: Bengaluru

Company Overview:

AISemiCon is at the forefront of semiconductor innovation delivering cuttingedge solutions that power a wide range of industries including e.g. consumer electronics automotive AI etc.. We are seeking an experienced and resultsdriven Silicon Chip Lead with a proven track record of delivering multiple firstpass silicon successes. In this leadership role you will drive the architecture design and successful deployment of highperformance reliable silicon chips that exceed customer expectations.

Position Overview:

The Silicon Chip Lead will spearhead the endtoend design and development of advanced semiconductor chips focusing on achieving firstpass silicon success. This role requires a unique blend of technical expertise leadership and strategic oversight combining deep knowledge of silicon design verification and postsilicon validation. The ideal candidate will have extensive experience leading chip development efforts and optimizing design processes to ensure highquality firstpass results.

As the Silicon Chip Lead you will collaborate with crossfunctional teams including hardware software and system engineers to deliver complex chips that meet stringent performance power and reliability goals. You will also mentor and guide junior engineers creating a culture of excellence in design and .

Key Responsibilities:

1. Chip Architecture & Design Leadership:

• Lead the architecture and design of advanced silicon chips (e.g. ASICs SoCs or custom IPs) from concept to tapeout ensuring alignment with product requirements and timelines.
• Drive design decisions and tradeoffs across power performance area (PPA) and manufacturability.
• Define and implement innovative solutions for challenging technical problems to ensure the highest quality and performance in firstpass silicon.

2. First Pass Silicon Success:

• Leverage your experience in achieving firstpass silicon success to lead and drive the design to successful tapeout and manufacturing.
• Identify and mitigate risks early in the design process to prevent common issues that might lead to silicon bringup failures.
• Collaborate closely with silicon validation and postsilicon teams to ensure early success in realworld testing addressing any design issues proactively.

3. Crossfunctional Collaboration:

• Collaborate with hardware software verification and system teams to ensure seamless integration of silicon components into larger system architectures.
• Partner with the product and business teams to ensure the chip meets key customer and market requirements translating those requirements into actionable design objectives.

4. Mentorship and Team Leadership:

• Lead mentor and develop a team of talented engineers ensuring a high level of technical competence and fostering innovation.
• Provide guidance and direction on best practices in chip design verification and debug processes.
• Foster a culture of accountability continuous improvement and quality within the engineering team.

5. Verification and PostSilicon Validation:

• Own the overall chip verification strategy ensuring the development and of comprehensive test plans and methodologies.
• Lead the analysis of firstpass silicon test results and work with crossfunctional teams to rootcause any issues ensuring timely resolutions.
• Oversee the postsilicon validation process driving the closure of bugs and improvements.

6. Optimization and Performance Tuning:

• Optimize designs for power performance and area (PPA) ensuring chips meet stringent market and customer requirements.
• Lead the use of design optimization tools and techniques to achieve highperformance silicon balancing tradeoffs to achieve the optimal solution.

7. Process Improvement:

• Identify and implement improvements in the chip development lifecycle to increase efficiency reduce risk and improve firstpass success rates.
• Stay uptodate with the latest semiconductor process technologies design tools and best practices to ensure the team remains at the cutting edge.

Required Qualifications:

Education:

• Bachelors or Masters degree in Electronics/Electrical/Computer Engineering or a related field. A Ph.D. is a plus.

Experience:

• 20 years of handson experience in silicon chip design with 5 years in a leadership role ideally in a fastpaced productionoriented environment.
• Proven experience delivering multiple firstpass silicon successes across complex ASIC SoC or custom IP designs.
• Expertise in designing highperformance chips for applications such as e.g. AI networking consumer electronics automotive etc..
• Strong background in digital design (HDL Verilog/VHDL) RTL design and experience with key tools such as Cadence Synopsys or Mentor Graphics.
• Expertise in design for manufacturability (DFM) design for testability (DFT) and performance optimization techniques.
• Demonstrated ability to drive firstpass success in silicon by addressing design issues early and applying advanced validation techniques.

Technical Skills:

• Indepth understanding of silicon design processes including RTL design physical design timing closure and layout verification.
• Experience in complex systemonchip (SoC) architectures including embedded processors memory subsystems and highspeed interfaces.
• Familiarity with simulation emulation and debugging tools and handson experience with postsilicon validation processes.
• Strong knowledge of verification methodologies including functional performance and power verification.
• Experience in leading crossfunctional teams to identify and resolve postsilicon issues effectively.
• Deep understanding of process nodes (e.g. 7nm 5nm 3nm) and the impact of advanced technology nodes on design verification and manufacturing.

Preferred Qualifications:

• Experience in AI machine learning or highperformance computing chip designs.
• Familiarity with hardware security cryptographic design or other specialized domains.
• Expertise with advanced packaging technologies (e.g. 3D stacking chiplet designs).
• Knowledge of systemlevel architecture and its impact on chip design and performance.
• Experience with multiple silicon tapeouts and leading teams through production rampup.

What We Offer:

• Competitive salary and comprehensive benefits package.
• Opportunity to work on groundbreaking semiconductor technologies with a leading industry player.
• A collaborative fastpaced and innovative work environment.
• Significant career growth and development opportunities in a rapidly expanding company.

How to Apply:

Interested candidates should submit their resume and portfolio (if applicable) to . Please reference the position title Silicon Chip Lead in the subject line.