Lead Advanced Microelectronics Packaging Design Engineer

Lead Advanced Microelectronics Packaging Design Engineer

Company:

The Boeing Company

Boeing Defense Space & Security has an exciting opportunity as a Lead Advanced Microelectronics Packaging Design Engineer. Come join us as part of our Electronics Packaging team located in El Segundo CA.

Packaging Electronics team focuses the majority of their time on Satellite missions. However our diverse development portfolio provides opportunities to learn with exposure to the breadth of the Boeing product line approximately half our design work is within the Space & Launch business unit and half is from other parts of Boeing (AvionX; Missiles & Weapons; Strike Surveillance and Mobility; and Autonomous Systems)..

Using first principals thinking Engineers will work on electronic packaging designs and take it from cradle to grave. Working within a collaborative team environment surrounded by world class engineers and mentors you will design within the full life cycle and see your work from proposal all the way to delivery and production. Were highly supportive of innovative thinking we respect and acknowledge hard work we recognize maturity and integrity and we reward bottomline achievement. At Boeing we value your curiosity your determination and your imagination. #YouWillChangeTheWorld

Position Responsibilities:

• Designing and optimizing layout for advanced substrates of HDI IC substrate Silicon or LTCC substrates considering electrical thermal and mechanical requirements.

• Collaborate in multifunctional discussions for package architecture and technology roadmap (partner with Silicon IC team to optimize chip Floorplan and bump placement).

• Crossfunctional interface with IC design materials SI/PI thermal systems and production teams to optimize package solutions on cost performance manufacturability and reliability

• Interface with packaging assembly and substrate suppliers for new product bringup qualification and production ramp

• Interface with other operations functional groups such as product engineering foundry test and QA

• Create and execute substrate breakout patterns for ASIC packaging

• Optimize package pinouts by evaluating systemlevel tradeoffs Conduct package routing placement stackup reference plane and power distribution activities

• Conduct design feasibility studies to assess package design goals encompassing size cost and performance

• Develop symbols and CAD library databases using Cadence APD or Mentor Xpedition tools

• Works under minimal direction

Basic Qualifications (Required Skills/Experience):

• Ability to obtain a U.S. Security Clearance

• Bachelor of Science degree from an accredited course of study in engineering engineering technology (includes manufacturing engineering technology) chemistry physics mathematics data science or computer science

• 5 years of experience as a substrate designer or 9 years of professional experience with substrate layout design

• Handson experience with package design and proficient in Cadence Allegro platform tools (PCB Editor Advanced Package Designer APD/SiP) or Mentor Xpedition platform tools.

Preferred Qualifications (Desired Skills/Experience):

• Experience with TSV 2D/2.5D and 3D package connection.

• Handson expertise of advanced and new assembly processes for flipchip wirebond and MCM packages

• SI/PI tools (XtractIM PowerSI HFSS Q3D etc. package model extraction Sparameters and RLGC model.

• Substrate manufacturing process structure design rules and material property.

• Solid understanding of highspeed interfaces including DDR PCIe NAND etc.

• Consistent track record to drive package selection through feasibility studies and drive chip Floor planning and bump assignment.

• Familiar with package design reviews and familiarity with CAM350/Valor or Calibre and CAD.

• Knowledge of highspeed layout constraints (crosstalk mitigation differential pairs EMI/RFI PCB/package resonance).

• Familiar with Cadence Concept HDL for schematic review experience in schematic capture and system integration.

• Experience in advanced node IC layouts such as 22nm 16nm 7nm 5nm or below

• Experience in layout of sensitive RF blocks such as low noise amplifiers voltage controlled oscillators and mixers

• Understanding of layout considerations for device matching coupling and noise isolation

• Knowledge of advanced substrate manufacturing/process

• Knowledge of failure analysis techniques on advanced node silicon products

• Conceptual knowledge of package cost structure

• Knowledge of GD&T and be able to read/comprehend mechanical drawings

• Excellent oral and written communication skills and ability to communicate across multiple disciplines with internal and external customers

• Computer proficiency and ability to use and navigate the internet and various computer software programs (e.g. Microsoft Office Suite)

• Skill and ability to collect organize synthesize and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources.

Drug Free Workplace:

Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for opioids amphetamines PCP and alcohol when criteria is met as outlined in our policies.

Total Rewards & Pay Transparency:

At Boeing we strive to deliver a Total Rewards package that will attract engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.

The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs generally including health insurance flexible spending accounts health savings accounts retirement savings plans life and disability insurance programs and a number of programs that provide for both paid and unpaid time away from work.

The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location date of hire and the applicability of collective bargaining agreements.

Pay is based upon candidate experience and qualifications as well as market and business considerations.

Summary pay range: $126650 $171350

Language Requirements:

Not Applicable

Education:

Bachelors Degree or Equivalent

Relocation:

This position offers relocation based on candidate eligibility.

Export Control Requirement:

This position must meet export control compliance requirements. To meet export control compliance requirements a U.S. Person as defined by 22 C.F.R. 120.15 is required. U.S. Person includes U.S. Citizen lawful permanent resident refugee or asylee.

Safety Sensitive:

This is not a Safety Sensitive Position.

Security Clearance:

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Top Secret Clearance PostStart is required.

Visa Sponsorship:

Employer will not sponsor applicants for employment visa status.

Contingent Upon Award Program

This position is not contingent upon program award

Shift:

Shift 1 (United States of America)

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