Advanced Package Technology Principal Engineer
Advanced Package Technology Principal Engineer
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Salary Not Disclosed
1 Vacancy
Job Description
About Marvell
Marvells semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise cloud and AI automotive and carrier architectures our innovative technology is enabling new possibilities.
At Marvell you can affect the arc of individual lives lift the trajectory of entire industries and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation above and beyond fleeting trends Marvell is a place to thrive learn and lead.
Your Team Your Impact
The Marvell Advanced Packaging R&D team is responsible for package design and technology development to meet the electrical mechanical thermal and system requirements for the next generation high performance computing (HPC) Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity power integrity thermal integrity mechanical integrity processability manufacturability and reliability involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multichip multiple component configurations involving but not limited to 2.5D and 3D packages Copackaged copper or optics and advanced substrates. Marvell has partnered with the worlds leading manufacturers to solve our customers most challenging designs and integrations with industryleading packaging technologies.What You Can Expect
Work with stakeholders to define and validate advanced design rule roadmap for interposer substrates and packages.
Work with vendors to define and validate equipment process and material roadmap.
Explore technologies beyond what is currently available make recommendations and create and protect IP to maximize performance.
Explore technology feasibility and create proofofconcept samples.
Collaborate with IP Si design package design production and test teams.
What Were Looking For
Experience in advanced package and substrate technologies with deep understanding of process and materials component and board level reliability warpage and thermal management.
Experience in managing substrate and assembly material vendors substrate manufacturers OSATs and foundries.
Bachelors degree in Mechanical Engineering Material Science Electrical Engineering or related fields and 1015 years of related professional experience. OR Masters degree and/or PhD in Electrical Engineeringechanical Engineering Material Science or related fields with 510 years of experience.
Skills needed to be successful in this role:
Deep understanding of advanced 2.5D/3D package technology including (a) CoWoSS/R/L (b) EMIB (c) CPO (d) CPC.
Strong understanding of chippackage interactions and failure mechanism at component and board level thermal and warpage management.
Ability to manage programs involving crossfunctional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe.
Ability to influence suppliers to align their roadmap with company goals.
Strong communication presentation and documentation skills
The ideal candidate would have:
Understanding of component (substrate interposer etc. and package designs.
Knowledge of signal integrity and power integrity.
Board and system level integration.
Experience with silicon disaggregation and reaggregation and memory integration.
Expected Base Pay Range (USD)
$ per annumThe successful candidates starting base pay will be determined based on jobrelated skills experience qualifications work location and market conditions. The expected base pay range for this role may be modified based on market conditions.
Additional Compensation and Benefit Elements
At Marvell we offer a total compensation package with a base bonus and equity.Health and financial wellbeing are part of the package. That means flexible time off 401k plus a yearend shutdown floating holidays paid time off to volunteer. Have a question about our benefits packages health or financial Ask your recruiter during the interview process.All qualified applicants will receive consideration for employment without regard to race color religion sex national origin sexual orientation gender identity disability or protected veteran status.
Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at .
#LIMM1Required Experience:
Staff IC
Employment Type
Full Time
