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This position is for the Post Silicon Engineering group that develops test solutions for highly integrated SOCs ( System on Chip).
Engineer will be responsible for characterization and developing cost-effective manufacturing test solution for HSIO (SERDES) for leading-edge SoC products in the most advanced processes. These include but not limited to HSIO PHY testing with automated test equipment (ATE).
Main responsibilities includes defining and executing the development of Test methodologies and characterization of High Speed SERDES Interfaces such as PCIe, USB3, UFS,DP, MIPI(DSI,CSI). Engineer will be developing Characterization and Test Plans, identifying DFT and test hardware requirements and developing ATE tests/routines/programs to execute test plans. Engineer will be driving first silicon debug to qualify designs fabricated at external foundries, performing technical data analysis of parametric performance over various operating conditions and configurations, driving failure analysis to completion, analyzing high volume manufacturing yields and driving test time reduction. Engineer with be working with cross-functional teams such as IC Design, Systems Engineering, Process Engineering, Hardware Applications, Customer Engineering across the globe in a time critical environment driving improvements in the yield, test time, and quality. The individual selected for the position should be passionate about delivering quality work products, seek to continually learn about Qualcomm products as well as essential knowledge of industry trends, competitor products, and advances in various engineering fields from publicly available information and assist in conducting specialized analyses (e.g., feasibility studies, signal integrity, teardown analyses).
Full Time