Specialist Mechanical Engineer Packaging

Specialist Mechanical Engineer Packaging

Location: Fort Wayne, Indiana
Full time direct hire

Full benefits

Relocation package

US Citizen

Job Description:

Client is seeking a Mechanical Engineer to be part of our growing mechanical packaging product development team; interested in developing mission critical products that matter.

Essential Functions:

• Design and Development of rugged, high performance, complex electro-mechanical hardware and packaging for harsh environments.
• Executing design engineering trade studies in a structured, detailed manner, within a cross functional environment to identify and recommend solutions meeting technical, cost, quality and schedule requirements.
• Development of innovative packaging solutions that solve challenging size, weight, and power requirements.
• Project management of mechanical packaging sub-system design teams from concept development through production release, qualification testing and delivery.
• Delivering functional designs robust to the variation of fabrication, assembly, and materials; as well as the product's operational, launch, test, and integration environments.
• Proactively seeks knowledge and design feedback from relevant organizations and individuals across the products value chain and incorporating lessons learned into active and future designs.
• Initiates, leads, and participates in, technical, process, assembly, and test peer reviews of designs.
• Supporting, brainstorming, and/or leading lean improvement initiatives to reduce waste and improve efficiency.

Qualifications:

• Ability to obtain security clearance.
• BS in Mechanical Engineering from an accredited college/university
• (4) years minimum experience working as a mechanical engineer.
• Experience in the area of assembly design and packaging of physical components.
• Experience in CAD 3D Design/Modeling techniques.
• Excellent Communication skills and interpersonal skills.
• Ability to work independently or within a multi-disciplined team environment.
• Experienced presenting Design Reviews to team leaders.
• Experienced in the application of ASME Y14.5 GD&T.
• Knowledge of design practices with respect to tolerances, variation of material properties, and DFMA.
• Experienced in working as part of a mechanical design team and leading small teams of MCAD Designers and mechanical engineers.

Preferred Additional Skills:

• Experience electro-mechanical packaging and engineering of Rugged Electronics Packages.
• DFMA Analysis.
• Tolerance Stack-up Analysis.
• Design, Schedule and Cost Estimating for Proposals experience
• Proficient in PTC CREO.
• Direct experience with mounting circuit card assemblies (CCA) into rugged lightweight enclosures.
• Knowledge of ESD/EMI use of gaskets, coatings, connectors desired.
• Photosensitive detectors, thin film coatings, & adhesives experience.