Senior Principal Engineer, Silicon Photonics Architect

Lead the architecture and provide guidance for technical execution of photonic integrated circuit (PIC) and electronic integrated circuit (EIC) platforms delivering pilot projects that prove technology feasibility system value manufacturability and a path to productization.

Job Summary

• Own end-to-end architecture for silicon photonics solutions that combine PICs EICs advanced packaging optical interfaces firmware and system-level control.
• Translate product customer and business requirements into system architecture technical specifications performance budgets interfaces technology choices and executable pilot plans.
• Define and deliver pilot demonstrators that de-risk critical capabilities such as optical I/O co-packaged optics chiplet connectivity sensing or other strategic silicon-photonics use cases.
• Provide technical leadership across concept modeling design tape-out packaging bring-up characterization and proof-of-value demonstrations.
• Build a pragmatic roadmap from prototype to scalable products including platform reuse ecosystem choices and make/buy/partner recommendations
• Define system requirements and partition functionality across PIC EIC package substrate/interposer optics firmware and host interfaces
• Create link and system budgets covering optical loss laser power modulation receiver sensitivity signal integrity power thermal behavior latency reliability and testability
• Guide PIC architecture and design tradeoffs involving modulators photodetectors waveguides couplers filters splitters monitors and calibration structures
• Guide EIC architecture and tradeoffs involving laser/modulator drivers TIAs clocking/CDR SerDes interfaces ADC/DAC or control loops telemetry power management and digital control
• Lead architecture reviews and design reviews; establish interface specifications verification plans risk registers success criteria and measurable pilot exit gates.
• Coordinate foundries OSAT/advanced-packaging partners IP vendors EDA/tool providers laboratories and university or ecosystem collaborators
• Partner with product software design verification packaging test reliability manufacturing and business teams to achieve performance cost schedule and quality objectives
• Mentor architects and engineers raise technical capability across the organization and communicate recommendations clearly to senior technical and business leaders.

Contribute to invention disclosures patents technical publications supplier assessments and longer-term silicon-photonics technology strategy

Qualifications :

• BTech/BE MTech/ME or PhD in Electrical Engineering Electronics Photonics Applied Physics Computer Engineering or a related field with  hardware engineering experience of 15 years
• Deep expertise in silicon photonics optical communications photonic integration electro-optic systems or closely related semiconductor technologies
• Proven experience architecting or delivering at least one complex PIC/EIC optical transceiver optical I/O co-packaged optics or integrated photonics program from concept through silicon or hardware validation.
• Strong understanding of PIC building blocks and passive/active optical behavior supported by modeling simulation laboratory characterization and data-driven design tradeoffs.
• Strong understanding of high-speed mixed-signal EIC functions and the electrical/optical interfaces between drivers modulators photodetectors TIAs clocking control and digital logic.
• Working knowledge of semiconductor process technologies PDK-based design DFM process variation yield reliability thermal constraints packaging assembly and production test.
• Ability to use or direct use of photonic electromagnetic circuit link thermal and signal-integrity simulation tools; ability to correlate models with measured results.
• Excellent problem-solving written and verbal communication technical influence teamwork attention to detail and commitment to execution quality.
• Prior experience with technologies and standards relevant to high-speed links such as Ethernet/IEEE OIF CEI PCIe/CXL connectivity SerDes FEC and system management interfaces
• Any of following experience would be a plus : Co-packaged optics optical I/O chiplets pluggable optical modules data-center interconnect AI/HPC fabrics or high-speed Ethernet applications Advanced packaging such as 2.5D/3D integration interposers hybrid bonding flip-chip fiber attach laser integration thermal solutions and package-level optical/electrical co-design

Additional Information :

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. As the industrys leading expert in embedded processing with unmatched quality and system-level know-how we have evolved to provide scalable and comprehensive semiconductor solutions for automotive industrial infrastructure and IoT industries based on the broadest product portfolio including High Performance Computing Embedded Processing Analog & Connectivity and Power.
 
With a diverse team of over 21000 professionals in more than 30 countries we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable power-efficient solutions today that help people and communities thrive tomorrow To Make Our Lives Easier.     
 
At Renesas you can: 

• Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.  

• Make a real impact by developing innovative products and solutions to meet our global customers evolving needs and help make peoples lives easier safe and secure. 

• Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system including the remote work option and Employee Resource Groups will help you excel from the first day.    

Are you ready to own your success and make your mark  

Join Renesas. Lets Shape the Future together.  

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. With a global team of over 21000 engineers and problem solvers in more than 30 countries we offer the opportunity to work on worldleading technology for Automotive Industrial Infrastructure and IoT shaping a safer healthier greener and smarter future.

At Renesas TAGIE is our culture grounded in being Transparent Agile Global Innovative and Entrepreneurial. It shapes how we work grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Remote Work :

No

Employment Type :

Full-time