Senior Package Design Engineer

We are looking for a Package Design Engineer to join our advanced silicon packaging design and simulation team and contribute to the design and delivery of highperformance 2.5D/3D chipletbased FCBGA SiP wire bond and QFP/QFN packages used in industryleading products. The role requires strong technical depth in package layout execution manufacturability and crossdomain codesign with silicon SI/PI thermal and reliability teams.

Key Responsibilities

• Perform package layout design and development for advanced packages including 2.5D/3D IC FCBGA SiP and multichip modules.
• Develop and maintain package CAD databases ensuring accuracy and adherence to design guidelines Design for Manufacturing (DFM) and Design for Assembly (DFA) requirements to ensure producibility.
• Manage end-to-end design cycle including schematic creation netlist import footprint assignment and generation of manufacturing outputs (Gerbers drill data fabrication/assembly drawings).
• Create and modify substrate/RDL layouts bump maps escape routing and power/ground structures.
• Work closely with SI/PI thermal reliability and DFT teams to support codesign and optimization and participate in design reviews.
• Ensure designs comply with foundry OSAT and manufacturing design rules (DRC LVS).
• Support ECO cycles design updates and version control throughout the project lifecycle.

Qualifications :

Minimum Qualifications

• 6 years of handson experience in package CAD layout and development.
• Strong experience with 2.5D / 3D IC packaging FCBGA and advanced substratebased packages multidie and chipletbased designs.
• Proficiency in industrystandard tools such as: Cadence Allegro Package Designer (APD / SiP) Siemens Xpedition / Innovator 3D IC or equivalent.
• Experience working with advanced manufacturing design rules and interface with OSATs.
• Good understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals and HighSpeed Design concepts.
• Strong communication presentation and documentation skills with the ability to work effectively in a team environment.

Additional Information :

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. With a global team of over 21000 engineers and problem solvers in more than 30 countries we offer the opportunity to work on worldleading technology for Automotive Industrial Infrastructure and IoT shaping a safer healthier greener and smarter future.

At Renesas TAGIE is our culture grounded in being Transparent Agile Global Innovative and Entrepreneurial. It shapes how we work grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Remote Work :

No

Employment Type :

Full-time