Lead CPU Design Engineer Jobs in Shanghai

Job Description:客户需求/设计输入负责预研及开发客户及市场的需求并以之作为设计输入Customer Requirements / Design Input Responsible for pre-research and development of customer and market requirements and using them as design inputs.-详细设计负责新产品的详细设计并在设计中应用质量工具Detail designRespo...

Manufacturing Support: Responsible for resolving manufacturing and assembly process challenges.Process Expertise: Practical expertise in processes such as injection molding metal fabrication forging rubber compounding and welding as well as their respective applications is required.Role ContextOnsit...

DescriptionPrimary Duties & ResponsibilitiesWork independently on hardware design and development tasks including but not limited to:Evaluation of optical / RF componentsRF Design / Analog & Digital Design and SimulationPCB LayoutDesign Verification Testing and TroubleshootingDevelop hardware for tr...

DescriptionIf you are a Systems Architect professional looking for an opportunity to grow your career Emerson has an exciting opportunity for this role you will design and develop systems and solutions that drive customer success using NIs platform and cross-product architectures. You will apply bro...

Design and develop Power Modules which use embedded die laminate technology with SMT of Cap and Inductor for Renesass packaging needs in the areas of Commercial Industrial power device packaging for servers and AI.Define package technologies tooling & qualification for Commercial Industrial power de...

Key Responsibilities Benchmark select and qualify suitable materials processes and assembly subcontractors (OSAT) or contract manufacturers (CM). Work with OSAT/CM to develop run DOE to optimize processes establish process spec & monitor and resolve process issues early in the production to ensure o...

Design and develop package and interconnect methods for Renesass packaging needs in the areas of Power SiP/modules wafer level chip scale package flip-chip multi-chip module LGA and power device packaging.Experience of embedded substrate development which has FET die & IC driver & capacitors.Package...

Design and develop package and interconnect methods for Renesass packaging needs in the areas of Power SiP/modules wafer level chip scale package flip-chip multi-chip module LGA and power device packaging.Strong understanding on wafer processing such as Cu Front side of metal/Backgrind Backmetal Tai...

Additional Information : Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. With a global team of over 21000 engineers and problem solvers in more than 30 countries we offer the opportunity to work on worldleading technology for Automotive Industri...

Every day we get opportunities to make a positive impact on our colleagues partners customers and society. Together were pioneering the solutions of the future and unlocking the full potential of precious resources. Trusted to act on initiative we challenge conventional thinking to develop world-lea...