Engineer 6G RF Packaging

Huawei Canadahas an immediate permanent opening for an Engineer.

About the team:
Welcome to the Advanced Wireless Technology Wireless Lab an epitome of innovation located in Ottawa Canada. Here amid the dynamic panorama of technological progress our team consists mainly of seasoned graduate computer engineers and computer scientists. With diverse experiences ranging from fresh perspectives to decades-long industry immersion we are united by our fervour for pioneering wireless solutions.

About the job:

• Explore 2.5D/3D integration wafer-level packaging diverse interposers and embedded passives.

• Study low-loss die-to-die and die-to-package interfaces including micro-bumps vias and waveguide structures.

• Develop embedded shielding isolation structures and localized cooling for high-power RF arrays.

• Investigate additively manufactured RF structures and engineered materials for prototyping advantages.

• Perform full-wave EM simulations to quantify interconnect loss leakage coupling and noise.

• Design package transitions antenna feeds and grounding networks across die substrate and board boundaries.

• Coordinate VNA thermal and OTA array measurements to evaluate system-level package performance.

• Partner with internal specialists (RFIC antenna materials manufacturing) to frame cross-disciplinary research.

• Secure patents and invention disclosures while publishing papers and internal technical reports.

The total target annual compensation for this position ranges from $106000 to $156000 depending on education experience and demonstrated expertise.

About the ideal candidate:

• 5 years of relevant industry experiences.

• PhD in Electrical Engineering RF/Microwave Engineering Packaging or a related field (or equivalent advanced R&D experience).

• Deep knowledge of RF/microwave principles.

• Experience using full-wave EM and circuit simulation tools to model packages and correlate results with measure.

• Hands-on experience designing test vehicles and directing microelectronics assembly (e.g. PCB flip-chip wire bonding SMT molding).

• Proficiency with RF lab equipment (VNAs) probe station.

• Working knowledge of thermal management CTE mismatch stress warpage and reliability testing.

Additional Information:

Huawei Canada is committed to a fair inclusive and accessible recruitment process. If you require accommodation during any stage of the hiring process please let us know and we will work with you to meet your needs.

All applications for this position are reviewed directly by our hiring team we do not use artificial intelligence tools to screen or select candidates.