Yield improvement program Lead
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موقع الوظيفة:
الراتب شهرياً:
تاريخ النشر:
نُشرت منذ أكثر من 30 يومًا
عدد الوظائف الشاغرة:
1 عدد الوظائف الشاغرة
ملخص الوظيفة
Description -
HP is looking for a Yield Improvement Program Lead to join our global Reverse and Repair team.
This role has significant impact on customer experience and Service P&L leading technical process improvement initiatives across HP Indigos global Repair Centers with a clear objective to increase yield reduce scrap and improve process robustness.
Key responsibilities
Lead structured datadriven initiatives to improve repair Yield and reduce Scrap across global Repair Centers.
Analyze repair performance trends identify systemic loss drivers and define targeted improvement actions.
Define and drive Yield improvement roadmaps by part family and technology aligned with business priorities.
Lead endtoend investigations for recurring failures chronic lowyield parts and abnormal scrap trends.
Drive structured root cause analysis (A3 / 8D / RCA) at component assembly and process levels distinguishing between design process handling installation and logistics causes.
Identify nonrobust repair and installation steps and drive process simplification and mistakeproofing.
Improve repair procedures work instructions verification steps and embedded control points to eliminate repeated failures.
Build dashboards and structured reporting to track trends root causes and improvement effectiveness translating data into clear management insights.
Drive crossfunctional alignment with Repair Centers Quality R&D Spare Parts Organization and Suppliers leading crosssite task forces and ensuring corrective actions are implemented validated standardized and sustained.
Education Skills and experience
in Mechanical Engineering Electrical Engineering or equivalent.
4-6 years in engineering technical services or manufacturing technologies must.
Fluent in English (reading writing speaking) must.
Very strong technical background with Spare Parts repair/refurbish advantage.
Hands-on experience with Printing industry advantage.
Strong understanding of assemblies (drawings BOM wiring diagrams).
Proven ability to lead complex activities projects and teams without formal authority.
Experience with engineering processes: ECO waivers investigations.
Knowledge with measurement calibration methods and use of inspection tools.
Proficient in Microsoft Excel and PowerPoint.
10% travel
The position is defined for a two-year period with an option for extension
#LIPOST
Job -
EngineeringSchedule -
Full timeShift -
No shift premium (Israel)Travel -
Relocation -
Equal Opportunity Employer (EEO) -
HP Inc. provides equal employment opportunity to all employees and prospective employees without regard to race color religion sex national origin ancestry citizenship sexual orientation age disability or status as a protected veteran marital status familial status physical or mental disability medical condition pregnancy genetic predisposition or carrier status uniformed service status political affiliation or any other characteristic protected by applicable national federal state and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
For more information review HPsEEO Policy or read about your rights as an applicant under the law here: Know Your Rights: Workplace Discrimination is Illegal
Required Experience:
Senior IC
