Senior PCB Layout Engineer – Automotive HPC Embedded Platforms

Job Description

Own PCB layout implementation for automotive HPC and chiplet-based platforms translating approved schematics electrical constraints and mechanical requirements into manufacturable multilayer and HDI board designs. Deliver release-ready layouts that meet signal integrity power integrity reliability and fabrication requirements.

Key Responsibilities:

• Own component placement fine-pitch BGA escape routing and detailed routing for multilayer and HDI PCBs used in automotive HPC and chiplet-based systems.
• Implement constraint-driven routing for DDR/LPDDR PCIe Ethernet and SerDes controlling impedance length matching differential-pair geometry crosstalk and return paths in collaboration with SI/PI engineers.
• Define PCB stack-ups material requirements via structures and HDI build-up with hardware SI/PI mechanical and fabrication teams balancing electrical performance reliability and manufacturing capability.
• Implement power and ground planes decoupling placement and power routing to agreed current-carrying thermal EMI/EMC and power integrity requirements using Cadence Allegro Altium Designer or equivalent ECAD tools.
• Create and verify component footprints pad stacks and ECAD library data; maintain layout databases and controlled design revisions throughout the release process.
• Prepare fabrication and assembly release packages including Gerber/ODB data drill files stack-up specifications fabrication and assembly drawings placement data and associated BOM documentation.
• Conduct layout reviews design-rule checks and DFM/DFA/DFT checks; resolve fabrication and assembly queries with suppliers and implement agreed layout corrections in line with applicable automotive requirements and processes.
• Maintain PCB layout guidelines checklists and release documentation; communicate layout risks design trade-offs and delivery status proactively to cross-functional teams.

Qualifications :

Qualifications

• Bachelors degree in Electrical or Electronic Engineering or an equivalent qualification.
• 5 years of hands-on PCB layout experience with demonstrated ownership of complex high-density high-speed boards from placement through manufacturing release.
• Strong expertise in multilayer stack-ups HDI fine-pitch BGA escape routing microvias via-in-pad and constraint-driven routing including knowledge of fabrication capabilities and reliability trade-offs.
• Practical experience routing DDR/LPDDR PCIe Ethernet and SerDes with a solid understanding of impedance control timing constraints return paths decoupling and SI/PI-driven layout practices.
• Proficiency in Cadence Allegro Altium Designer or equivalent PCB layout tools including constraint management footprint and pad-stack creation library management and revision-controlled release workflows.
• Working knowledge of PCB fabrication and assembly processes DFM/DFA/DFT and relevant IPC standards; experience preparing manufacturing deliverables and resolving supplier feedback. Automotive PCB experience is preferred.
• Ability to interpret schematics and mechanical constraints explain layout trade-offs and work independently with hardware SI/PI mechanical and manufacturing teams.

Soft skills

• Result oriented
• Strong analytical and problem-solving mindset
• Structured and quality-driven working approach
• Ability to work effectively in cross-functional and global teams
• Good English communication (spoken & written)

Additional Information :

Further details regarding compensation and benefits will be shared during the interview process.

Remote Work :

No

Employment Type :

Full-time