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PCB Layout Expert – Automotive HPC Embedded Platforms

Bosch Group


Job Location:

Ho Chi Minh City - Vietnam

Monthly Salary: Not provided by the employer
Posted: 27 October 2026 (19 hours ago)
Application Deadline: 24 January 2027
Vacancies: 1 Vacancy

Job Summary

Job Description

Lead PCB layout for automotive HPC and chiplet platforms delivering manufacturable designs with design teams and external suppliers. Improve efficiency through AI-enabled automation process and library management and team mentoring.

Key Responsibilities:

  • Own multilayer/HDI placement fine-pitch BGA escape and routing from approved schematics and mechanical constraints through release.
  • Route DDR/LPDDR PCIe Ethernet and SerDes to SI/PI constraints; implement power/ground decoupling and thermal/EMC requirements.
  • Coordinate design SI/PI mechanical manufacturing teams and external PCB suppliers on stack-ups materials vias cost reliability and manufacturability.
  • Manage footprints pad stacks and ECAD libraries; improve request naming validation approval versioning traceability reuse and obsolescence processes.
  • Lead layout/DRC and DFM/DFA/DFT reviews resolve supplier issues and release Gerber/ODB drill stack-up drawing placement and BOM data.
  • Mentor layout engineers; maintain layout guidelines and checklists and guide application notes and customer presentations explaining trade-offs and risks.
  • Improve development handovers reviews change control and release workflows using reusable practices lessons learned and supplier feedback.
  • Apply AI-assisted tools and scripting to layout checks library verification and documentation; validate outputs protect design data and measure cycle-time quality and rework improvements.

Qualifications :

Qualifications

  • Bachelors degree in Electrical/Electronic Engineering or equivalent.
  • 10 years in complex high-speed PCB layout with end-to-end ownership and design-team/supplier coordination; automotive experience preferred.
  • Expertise in multilayer/HDI stack-ups BGA escape microvias via-in-pad fabrication capabilities and reliability trade-offs.
  • Strong DDR/LPDDR PCIe Ethernet and SerDes routing skills: impedance timing differential pairs crosstalk return paths and SI/PI.
  • Proficient in Cadence Allegro Altium Designer or equivalent; experienced in constraint management libraries and revision-controlled releases.
  • Knowledge of PCB fabrication/assembly DFM/DFA/DFT relevant IPC standards and manufacturing deliverables.
  • Experience improving development/library processes and applying scripting ECAD automation interfaces and AI tools with validated efficiency gains.
  • Experience mentoring engineers and preparing layout guidelines application notes and customer technical presentations.

Soft skills

  • Results-oriented structured and quality-driven; strong analysis root-cause problem-solving and independent ownership.
  • Proactive collaboration across global teams and external suppliers.
  • Clear English communication technical writing and customer presentation skills.

Additional Information :

Further details regarding compensation and benefits will be shared during the interview process.


Remote Work :

No


Employment Type :

Full-time


About Company

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Bosch first started in Vietnam with a representative office in 1994. Bosch has its main office in Ho Chi Minh City, with branch offices in Hanoi and Da Nang, and a Powertrain Solutions plant in the Dong Nai province to manufacture pushbelt for continuously variable transmissions (CVT) ... View more

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