8 Jobs Found | Sort By : Relevance | Posted Date
Less results matching your search!
Try removing some of the filters to get more results
No results matching your search!
Try removing some of the filters to get more results
Senior Staff, Technical Program Management, Power ...
Own the execution of Renesas strategic AI/Datacenter Infrastructure Power package engineering and New Product Introduction (NPI) programs from development and qualification through production ramp in a fast-paced high-growth environment. You will collaborate with product Technical Program Managers (...
Senior Manager, Package Design Engineering
Responsibilities:Lead package technology development and NPI execution including R&D activities coordination with global OSAT partners for new package development and product qualification technology roadmap implementation project budget tracking and customer adoption programs.Manage the design and...
Staff Package Design Engineer
In this role you will work at the intersection of IC design advanced package development and system-level implementation. You will play a critical role in designing and delivering next-generation high-performance semiconductor package solutions including power modules chiplet-based architectures FCB...
Manager, Company Secretarial
Assist the Senior Manager and/or Head of Department in overseeing the operations of the Corporate Secretarial function while helping build a capable collaborative and high-performing team. Guide supervise and mentor team members offering coaching and constructive performance feedback to support thei...
Packaging Engineering Intern
Work Flexibility: OnsiteWhat You Get Out of the InternshipAt Stryker we believe that developing the next generation of talent is just as important as developing life-changing medical technologies. As an intern youwontjustobserveyoullcontribute to meaningful projects gain exposure to leaders who will...
Senior Staff Package Design Engineer
Design and develop package and interconnect methods for Renesass packaging needs in the areas of Power SiP/modules flip-chip LGA multi-chip module with substrate or embedded die/capacitor and power device packaging. Package technologies qualification for consumer & industrial power as well as automo...
Package Layout Design Engineer , Annapurna Labs Ai...
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time agoeven yesterday. Our custom chips accelerators and software stacks enable us to take on tec...
Package Layout Design Engineer , Annapurna Labs Ai...
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time agoeven yesterday. Our custom chips accelerators and software stacks enable us to take on tec...