Staff Thermal Engineer, Hardware Design

If youre reading this chances are that youre getting this information over at least one piece of hardware that we designed developed manufactured or service. Celestica is the brand behind the brands you love in tech. We design develop and manufacture leading-edge Hardware Platform Solutions in Networking Storage and Server solutions from general purpose to customized Cloud AI machine learning Edge and 5G deployments. Across Data Centers and Enterprise deployments we are partnered with an impressive roster of some of the worlds biggest tech companies. We work with 9 of the top 10 global internet service providers 4 of the top 5 global storage providers 3 of the top 5 networking OEMs and the top 3 non-X86 server providers engineering solutions for this generation and the next.

Our customers experience firsthand the power of our people - people who share a passion for innovation technology collaboration performance and quality. People who together make a formidable team that is not only transforming our company but transforming the technology landscape of the future. Celestica might not be a household name but as you evaluate the companies industries cultures and teams that you are considering for your next career move we hope that one thing will become very clear: Celestica is no ordinary company. We are change makers. Innovators. And we have an unrelenting drive to find the way for our customers.

Lets engineer the future together.

Join a world class team to create high end electronics cooling solutions for systems such as AI servers switches and accelerators. We work hard together to design at the leading edge of cooling technology. Must have relevant coursework in heat transfer and fluid mechanics and good familiarity with 3D software applications.

As a member of the Hardware Product Development team you have the ability to work in partnership with hardware software and thermal architects within and outside Celestica to define the best in class products. Celestica has a profoundly cooperative and nonconfrontational culture.

• Complete ownership of thermal design for various electronic products from thermal modeling design test and design revision until transfer to manufacturing.
• Conduct thermal simulations postprocessing and analysis ranging from chip to facilities level to verify thermal feasibility risk and to inform your designs.
• Maintain awareness of heat transfer hardware available from all sources including how it operates and performs its cost and how it can be incorporated into our products.
• Conceive and implement ways to enhance and extend operation of heat transfer hardware.
• Consider the thermal aspects of chip packaging technologies.
• Apply best-in-class fluid flow geometry and technology to cool high heat flux chips.
• Determine and consider the effects of contact resistance and the use of Thermal Interface Materials.
• Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost.
• Size liquid cold plates heat sinks heat pipes air movers air filters air ducting and perforated plates.
• Plan your work to achieve full required performance and stay on schedule to support overall product development.
• Reference real world limitations to inform your work such as manufacturing methods and cost reliability variability of incoming parts and tolerances on all specifications.
• Perform hands-on lab tests of equipment from component to rack and facility level for design and model validation. Document thermal test plans devise and build test stands including technical support cooling liquid supply power delivery metrology and instrumentation compute workload experiment control and data recording.
• Analyze test data to draw inferences about the equipment tested. Apply statistical methods as required to maximize utilization of data and test usefulness.
• Work with multi-disciplinary groups to define system requirements and design products.
• Work with cross-functional teams to identify root causes of system performance.

Masters degree in Mechanical Engineering. Preference given to candidates with their Masters concentration in heat transfer and fluid mechanics.

Educational Requirements may vary by Geography

This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.

The salary range described in this posting is an estimate by the Company and may change based on several factors including by not limited to a change in the duties covered by the job posting or the credentials experience or geographic jurisdiction of the successful candidate.

Salary Range: $128K - $200KAnnually