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Sr. PrincipalStaff PCB Layout Designer

DPP

Job Location:

Cincinnati, OH - USA

Monthly Salary: Not provided by the employer

Posted: 21 October 2026 (Yesterday)

Application Deadline: 18 January 2027

Vacancies: 1 Vacancy

Job Summary

DPP is seeking a Sr. Principal/Staff PCB Layout Designer for an opportunity with our client in the Aerospace and Defense Manufacturing industry.

Work Location: Onsite in Cincinnati OH
Duration: 6 months
Terms: W2 Contract
Work Authorization: US Citizen; must hold a current/active Top Secret SCI clearance

Responsibilities:

Execute the placement and routing of complex highdensity multilayer printed circuit boards (PCBs) including highspeed digital RF mixedsignal and power circuits.
Interpret electrical schematics constraints and mechanical boundaries to develop optimized PCB layouts that meet performance reliability and manufacturability requirements.
Generate and maintain complete PCB and circuit card assembly (CCA) fabrication and assembly documentation packages including artwork drawings fabrication notes and data outputs for procurement and assembly partners.
Apply current IPC and highreliability industry standards as well as applicable military and aerospace criteria in the design and verification of printed wiring boards and circuit card assemblies.
Collaborate closely with electrical mechanical manufacturing and signal integrity engineers to address layoutrelated design challenges involving signal integrity power integrity thermal management and packaging.
Support and perform Design for Manufacturing (DFM) Design for Assembly (DFA) and Design for Test (DFT) reviews using automated and manual checks to improve yield test coverage and product robustness.
Work with fabrication and assembly suppliers to understand manufacturing capabilities and constraints and incorporate them into PCB designs.
Support PCB library management practices ensuring correct use of symbols footprints and parameter data in accordance with internal workflows.
Independently own PCB layout tasks from concept through fabrication data release in support of program cost schedule and technical requirements.
Lead advanced PCB layout efforts using technologies such as HighDensity Interconnect (HDI) microvias viainpad backdrilling and specialized substrate materials; provide technical guidance peer reviews and mentoring to other layout designers.
This position may be filled at either a Sr. Principal Level or a Staff Level.
This requisition may be filled at a higher grade based on qualifications listed below.

Required Qualifications for a Sr. Principal PCB Layout Designer:

8 Years with Bachelors in Science; 6 Years with Masters; 4 Years with PhD Active Top Secret clearance.
Active Top Secret clearance.
Willingness and ability to work onsite fulltime at the Cincinnati OH location.
Minimum 8 years of experience performing engineering/layout of printed circuit boards using Xpedition.
Experience with the layout of multilayer highdensity PCBs and circuit card assemblies including placement and routing of highspeed digital RF and/or mixedsignal circuits.
Experience collaborating with diverse stakeholders across organizations and programs including electrical design mechanical design manufacturing test and/or signal integrity.
Working knowledge of PCB fabrication and assembly processes including common manufacturability and yield considerations.
Familiarity with IPC industry standards for PCB design and fabrication and current understanding of highreliability criteria.
Experience generating artwork and PCB/CCA documentation for procurement and assembly houses.
Excellent organizational and problemsolving skills with a demonstrated ability to adapt effectively to changing requirements.

Required Qualifications for a Staff PCB Layout Designer:

12 Years with Bachelors in Science; 10 Years with Masters; 8 Years with PhD.
Willingness and ability to work onsite fulltime at the Cincinnati OH location.
Minimum 12 years of experience performing engineering/layout of printed circuit boards using Xpedition.
Experience with the layout of multilayer highdensity PCBs and circuit card assemblies including placement and routing of highspeed digital RF and/or mixedsignal circuits.
Experience collaborating with diverse stakeholders across organizations and programs including electrical design mechanical design manufacturing test and/or signal integrity.
Working knowledge of PCB fabrication and assembly processes including common manufacturability and yield considerations.
Familiarity with IPC industry standards for PCB design and fabrication and current understanding of highreliability criteria.
Experience generating artwork and PCB/CCA documentation for procurement and assembly houses.
Excellent organizational and problemsolving skills with a demonstrated ability to adapt effectively to changing requirements.

Preferred Qualifications:

Prior experience in defense or space flight programs with stringent reliability documentation and traceability requirements.
Demonstrated expertise in the layout of advanced highdensity multilayer printed circuit boards combining RF highspeed digital and highpower circuit sections.
Knowledge of PCB process workflows and library management including creation and governance of symbols footprints and reusable layout elements.
Ability to translate complex mechanical boundaries and electrical constraints into optimized physical PCB layouts across multiple boards or modules.
Deep domain knowledge of highreliability military and aerospace hardware criteria (e.g. MILPRF31032 MILSTD883 IPC Class 3/3A) or comparable experience demonstrating equivalent rigor.

Interested Learn more:
Click the apply button to learn more about this position (#26-01310).

DP Professionals (DPP) offers a range of compensation and benefits packages to our employees and their eligible dependents. DPP is a certified Woman-owned Small Business Enterprise (WBE and WOSB) with more than 25 years in the staffing industry. EOE/AA/V/D

Required Experience:

Staff IC

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