Sr. MTS, Etch RF Engineering

About Mattson

Company:Mattson Technology Inc. a 38-year Silicon Valley company designs manufactures markets and globally supports plasma and rapid thermal processing equipment to fabricate integrated circuits for the global semiconductor industry.

Mattson Technology Inc. offers processing equipment that utilizes innovative technologies to deliver advanced processing capabilities and high productivity for the fabrication of current and next-generation integrated circuits. Our equipment and technologies are used by leading memory and logic analog /power device manufacturers worldwide. Innovations from Mattson Technology in Atomic Surface Engineeringaddress the most critical logic and memory manufacturing challenges.

In May 2016 Mattson Technology was acquired by Beijings E-Town Capital. Our new investors vision is that Mattson Technology with its Silicon Valley DNA will continue to operate as a global market-driven technology provider serving worldwide semiconductor manufacturing July 2025 the company successfully listed in Shanghais STAR Exchange. As the external trade compliance environment evolves Mattson Technology now operates independently from the parent company in product business and operations serving customers outside of China.

Key Responsibilities:

• Develop and improve RF components/systems for plasma processing equipment.
• Work in cross-functional teams within the BU (mechanical electrical systems process supply chain) along with suppliers to continuously improve the tools process capability performance and productivity.
• Characterization and qualification of new RF hardware for incorporation into the plasma processing equipment.
• Data analysis to rapidly provide solutions to customer problems and determine appropriate limits and specifications for tool operation.
• Lead projects and teams from C&F phase through to full release and high-volume manufacturing.
• Drive implementation of new technology solutions for customers including potential travel to customer sites.

Requirements:

• Ph.D. or MS with 5years relevant experience or BS with 10yearsrelevant experience.
• Detailed knowledge onstate of the artplasma etch/strip processinghardware designandhands ontroubleshooting skillsof plasma processing equipment.
• Able to deal with complicatedinternal or customerproblemsunder deadline pressure in a highly dynamic environment.
• Self-motivated andable to take initiative.
• Strong verbal and written communication skills.
• In-depth knowledge of the interaction between equipment design and process performance.
• Able and willing to travel internationally to support critical customerissues (up to 10%).