Silicon Photonics & Optical Packaging Engineer

Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture assembly optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics u0026 optical Packaging Engineer to join our this highly visible role you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies define assembly baseline processes decide package BOM establish optical coupling design/manufacturing that are optimized for performance reliability yield and cost.

Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.

Design and model silicon photonic devices and optical interconnects optimizing coupling thermal and signal integrity and simulate optical packaging architectures integrating photonic chips fibers and electronics using tools like Lumerical Zemax or and characterize integrated photonic packages correlating simulation with optical and electrical with cross-functional teams (process electrical mechanical reliability) to enable scalable manufacturable results and present technical findings through reports reviews or relevant forum presentations contributing to next-generation optical I/O development.

BS and a minimum of 20 years relevant industry experience

M.S or Ph.D. in Physic (Optics major) Electrical Engineering Materials Science Mechanical Engineering or an equivalent field desired preferred. nExcellent teamwork and communication theoretical background in optics and photonics fundamentals device/module -on experience in packaging and measuring fiber-coupled -on experience in optical component design simulation and qualification and single / multi-mode fiber assembly using active and passive alignment tool. nMin. 5 years works experiences in the related field with M.S and or -on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC CoW WLP ) nExperience with silicon photonics device laser modulator PD passive components such as Si WG MUX/DeMUX is a plus.