Silicon Photonics EPM, Data Center SoC

Silicon Photonics (SiPh) and optical I/O are rapidly becoming foundational to next-generation data center SoCs unlocking the bandwidth energy efficiency and reach that electrical interconnects can no longer sustain. This is a pioneering opportunity to help shape how Apples silicon connects at the speed of light. Are you a hard-working and proactive engineering leader with a curiosity about optics photonics and the future of high-bandwidth silicon interconnects We are absolutely seeking you out!

Apple is seeking an experienced Engineering Program Manager to lead Analog Mixed-Signal and Silicon Photonics IP programs within our silicon organization with a focus on data center this role you will drive the end-to-end development of high-speed AMS and optical IPs including SerDes PLLs Data Converters TIAs drivers and Silicon Photonics engines / optical I/O subsystems from early concept through mass production ensuring quality schedule and successful delivery across our SoC will bring deep familiarity with advanced packaging technologies (including 2.5D/3D near and co-packaged optics) cutting-edge silicon nodes SiPh process platforms and AMS IP development flows and methodologies in an SoC environment. You will serve as the connective tissue across SoC Integration IC Design SoC PD SoC DV Photonics Design Optical Packaging CAD Software Hardware Reliability and Legal defining test structure requirements establishing robust electrical and optical testing methodologies and ensuring all technical and compliance gates are met on ability to distill complex electro-optical technical information into clear communication identify risks across a multi-disciplinary supply chain (foundries OSATs laser and optical component vendors) develop mitigation strategies and align diverse cross-functional stakeholders will be critical to delivering on aggressive hardware milestones for data center silicon.

Drive Silicon Photonics u0026 Packaging Execution: Manage the program lifecycle for complex Mixed-Signal IP Silicon Photonics engines and optical I/O subsystems within data center SoC designs ensuring alignment from concept to tape-out to Optical I/O u0026 Co-Packaged Optics Programs: Orchestrate development of optical engine modules fiber array/connector integration and co-packaged optics (CPO) solutions in partnership with photonics design packaging and assembly on Proprietary Tech: Partner closely with foundational vendors silicon and photonics foundries OSATs and laser / optical component suppliers to co-develop proprietary hardware solutions tailored for next-generation data center Electrical u0026 Optical Testing Frameworks: Collaborate with engineering teams to define requirements for advanced electrical and optical test structures (loopback BER optical coupling wavelength thermal) and implement robust characterization and qualification Cross-Functional Teams: Act as the central hub connecting IC Design Photonics Design SI/PI Optical Packaging Reliability Operations Tooling and Legal to ensure all program dependencies compliance and technical gates are Program Management: Lead and synchronize global engineering efforts effectively managing communication and deliverables across multiple international time zones and a geographically distributed photonics Ambiguity in an Emerging Domain: Maintain high agility and execution velocity in the rapidly evolving SiPh and optical I/O landscape adapting schedules and strategies as project requirements standards and technologies pivot.

BS in Electrical Engineering Electrical and Computer Engineering Applied Physics Optics or a related field and 10 years of relevant track record in AMS IP Silicon Photonics or optical interconnect design or design engineering management.

MS or PhD in Electrical Engineering Physics (Optics) Photonics Materials Science or an equivalent -on program leadership experience with Silicon Photonics devices and subsystems (lasers modulators photodetectors waveguides MUX/DeMUX grating/edge couplers) and/or optical I/O and co-packaged optics (CPO) for data center experience with AMS IPs supporting optical interconnects including high-speed SerDes TIAs laser/modulator drivers CDRs and PLLs across advanced technology with optical packaging concepts: fiber-array attach active/passive alignment flip-chip and CoC/CoW/WLP assembly and thermal / reliability considerations for photonic leadership in delivering high-reliability AMS and/or photonic IPs for data center infrastructure at ability to define and drive multi-generational IP and optical interconnect roadmaps in alignment with product strategy and business track record of executive-level influence and stakeholder management across large matrixed organizations spanning silicon photonics packaging and supply expertise in advanced EDA tools IP development methodologies and SoC integration across cutting-edge technology nodes for data center of proactive risk management and real-time crisis leadership in high-complexity high-visibility programs with direct executive with adjacent optical technologies (uLED uVCSEL) and their applications to SoCs is a plus.