Senior Applications Engineer

Senior Applications Engineer

Thick Film Substrates Modules and Microelectronics Assembly

REMTEC Canton Massachusetts Primarily On-Site $120000$140000

Do you enjoy solving complex engineering challenges working directly with customers and helping fellow engineers succeed Remtec is seeking a Senior Applications Engineer to connect customer requirements with practical high-performance electronics manufacturing solutionsand lead a small applications engineering team.

This opportunity is well suited for an experienced applications or product engineer who enjoys customer interaction and is ready to expand their leadership impact. Experience with thick-film ceramics is valuable but strong PCB design and layout experience can provide a foundation for success.

Remtec specializes in advanced ceramic packaging technology printed circuit boards (PCBs) substrates and components used throughout the electronics industry. We work with customers to develop specialized solutions for demanding applications bringing together technical design manufacturing expertise and collaborative problem-solving.

Lead mentor and support a team of three applications engineers setting priorities providing technical guidance and supporting performance and professional development.

Serve as a key technical contact for customers manufacturers representatives sales engineering and manufacturing teams.

Understand customer design requirements; review PCB layouts and electronic designs; recommend substrate packaging and assembly approaches that improve manufacturability and performance.

Guide customer design-in activities design reviews prototypes new product introductions and transitions into production.

Prepare and review technical quotations cost estimates and feasibility assessments; learn and apply Remtecs pricing methodology.

Partner with manufacturing production and quality teams to troubleshoot technical challenges address root causes and improve quality yield and process capability.

Create technical presentations application documentation and customer reports; participate in customer visits and relevant industry events.

Bachelors degree in Electrical Mechanical Manufacturing or Materials Science Engineering or a related technical discipline.

At least five years of relevant engineering experience in electronics design PCB technologies electronics manufacturing microelectronics packaging or related fields.

Working knowledge of PCB design circuit layout and design for manufacturability with practical CAD experience (such as AutoCAD SolidWorks or comparable tools).

Ability to communicate technical concepts clearly to customer engineers and internal teams evaluate design tradeoffs and recommend solutions.

Strong analytical project coordination and cross-functional collaboration skills; enthusiasm for customer-facing engineering and team leadership.

Ability to work primarily on-site and travel for customer visits and business needs.

Thick-film ceramic substrates; alumina (Al₂O₃) aluminum nitride (AlN) or beryllium oxide (BeO); hybrid microelectronics or advanced electronic packaging.

Knowledge of die attach wire bonding flip-chip SMT laser trimming soldering hermetic packaging or related assembly processes.

Experience mentoring or managing engineers; technical quotations cost estimating or customer-facing project management.

Exposure to aerospace defense medical RF/microwave or other high-reliability electronics including applicable quality and manufacturing standards.

Make a visible impact on customer solutions while taking ownership of an established engineering team. Work closely with manufacturing and product experts develop expertise in specialized electronics technologies and receive support from leadership that values initiative and autonomy. Engineers ready for their first formal people-management opportunity are encouraged to apply.

salary range: $120000$140000 annually

Primarily on-site in Canton Massachusetts.

Approximately 1530% travel depending on business needs.