Principal Subsystem Design Engineer

Microsoft Silicon Cloud Hardware and Infrastructure Engineering (SCHIE) is the team behind Microsofts expanding Cloud Infrastructure and responsible for powering Microsofts Intelligent Cloud mission. SCHIE delivers the core infrastructure and foundational technologies for Microsofts over 200 online businesses including Bing MSN Office 365 Xbox Live Teams OneDrive and the Microsoft Azure platform globally with our server and data center infrastructure security and compliance operations globalization and manageability solutions. Our focus is on smart growth high efficiency and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission.

As Microsofts cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time in high volume with high quality and lowest cost is of paramount importance. To achieve this goal the Artificial Intelligence System on Chip (AISoC) team is instrumental in defining and delivering operational measures of success for hardware manufacturing improving the planning process quality delivery scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.

We are looking for a Principal Subsystem Design Engineer to join the team.

#SCHIE

• Provide technical leadership for Memory Subsystem development as a Design engineer driving solutions from architecture and microarchitecture through silicon bring-up.

• Lead the design integration and verification of high-performance complex SoC subsystems with a focus on memory technologies bandwidth latency utilization power and overall system efficiency.

• Collaborate closely with Architecture RTL Design DV Physical Design (PD) Design-for-Test (DFT) Firmware and Post-Silicon teams to resolve system-level issues and deliver robust silicon.

• Drive vertical and horizontal IP/component reuse across projects and platforms ensuring scalable and efficient subsystem architectures.

• Provide technical leadership through mentorship design reviews code reviews and cross-functional collaboration helping to establish and maintain engineering best practices.

• Develop and optimize subsystem architectures involving PCIe HBM imaging and control subsystems interconnect fabrics AMBA AXI/CHI protocols DMA engines NoCs and high-throughput data buffering and movement.

• Drive design implementation including microarchitecture specification RTL development and integration using Verilog/SystemVerilog synthesis timing constraints floor-planning considerations performance optimization and design-quality closure including CDC lint and RDC.

• Debug complex design and system-level issues across simulation emulation and silicon working across disciplines to identify root causes and implement effective solutions.

• Drive execution in an Agile development environment including sprint planning feature deployment code reviews issue resolution and continuous improvement of design and verification processes.

• Champion high-quality engineering execution and contribute to delivering cutting-edge custom IP and SoC solutions that meet demanding performance power efficiency and schedule requirements.

Required Qualifications:

• Doctorate in Electrical Engineering Computer Engineering Computer Science or related field AND 3 years technical engineering experience
• OR Masters Degree in Electrical Engineering Computer Engineering Computer Science or related field AND 6 years technical engineering experience
• OR Bachelors Degree in Electrical Engineering Computer Engineering Computer Science or related field AND 8 years technical engineering experience
• OR equivalent experience.

Other Requirements:

• Ability to meet Microsoft customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud background check upon hire/transfer and every two years thereafter.

• This role will require access to information that is controlled for export under export control regulations potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations the EU Dual Use Regulation and/or other export control a condition of employment the successful candidate will be requiredto provide either proof of their country of citizenship or proof of their US. residency or other protected status(e.g. under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled meet this legal requirement and as a condition of employment the successful candidates citizenship will be verified with a valid passport. Lawful permanent residents refugees and asylees may verify status using other documents where applicable.

Preferred Qualifications:

• 9 years of experience in RTL design with a proven track record of delivering high-performance IP SS or SoC designs such as PCIe DDR or HBM.

• Expertise in microarchitecture specification RTL coding and design verification collaboration.

• Experience in synthesis timing constraints power / performance / area (PPA) trade-offs and post-silicon debug.

• Experience with design quality and static checks DFT implementation and hand off to physical design.

• Lead experience for an IP or SS related to CPUs VPUs GPUs Direct Memory Access (DMA) engine Tensor unit or similar

• Experience with lead roles across cross-functional / cross-time-zone engineering teams

• Experience of working on Artificial Intelligence (AI) / Machine Learning (ML) SoCs

• Experience in Scripting language such as Python or Perl