Principal Mechanical Engineer AI Systems
Job Location:
Mountain View, CA - USA
Yearly Salary:
Posted:
Application Deadline:
Vacancies:
Department:
Job Summary
Microsoft Silicon Cloud Hardware and Infrastructure Engineering (SCHIE) is the team behind Microsofts expanding Cloud Infrastructure and responsible for powering Microsofts Intelligent Cloud mission. SCHIE delivers the core infrastructure and foundational technologies for Microsofts over 200 online businesses including Bing MSN Office 365 Xbox Live Teams OneDrive and the Microsoft Azure platform globally with our server and data center infrastructure security and compliance operations globalization and manageability solutions. Our focus is on smart growth high efficiency and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission.
Our Mechanical Engineering team is responsible for developing the server rack and infrastructure platforms that power Microsofts global cloud and AI services. We partner closely with electrical thermal manufacturing supply chain and datacenter operations teams to deliver innovative reliable and scalable hardware solutions from concept through deployment.
The Principal Mechanical Engineer will lead the design and deployment of future high density liquid-cooled systems in Azure datacenters.
#SCHIE
Responsibilities
Lead Mechanical Development: Deliver innovative mechanical designs for server and cooling systems integrating thermal structural and electrical constraints with a deep understanding of server architecture and adjacencies.
Predictive Analysis & Empirical Validation: Apply advanced modeling (FEA CFD tolerance analysis) and empirical testing to validate structural thermal and reliability performance.
Design for Manufacturing & Reliability: Ensure manufacturability cost-efficiency and long-term reliability through material selection tolerance control supplier engagement and understanding of tooling and manufacturing processes.
Drive for Results: Set clear goals with measurable outcomes manage risk and ensure timely delivery of high-quality hardware solutions across product lines.
Strategic Thinking: Translate business and customer needs into scalable mechanical strategies that align with long-term product and platform vision.
Technology Pathfinding: Develop and explore innovative design strategies that anticipate future trends opportunities and industry shifts.
Develop Technical Talent: Mentor engineers to become thought leaders fostering growth through challenging assignments and continuous feedback.
Engineering Rigor & Agility: Balance innovation with disciplined execution ensuring quality as a key participant in structured design reviews test planning and root cause analysis.
Cross-Functional Collaboration: Partner with electrical thermal reliability and other domains to deliver cohesive customer-focused solutions.
Invent & Protect: Identify and develop intellectual property encouraging patent filings and contributing to Microsofts innovation portfolio.
Tool & Process Advancement: Evaluate and implement new tools technologies and methodologies to improve design quality and team productivity.
Qualifications
Required Qualifications:
- Doctorate in Mechanical Engineering or related field AND 3 years related technical engineering experience OR Masters Degree in Mechanical Engineering or related field AND 4 years related technical engineering experience OR Bachelors Degree in Mechanical Engineering or related field AND 6 years related technical engineering experience OR equivalent experience.
Other Requirements:
Ability to meet Microsoft customer and/or government security screening requirements is required for this role. These requirements include but are not limited to the following specialized security screening:
Microsoft Cloud Background Check. This position is required to pass the Microsoft Cloud Background Check upon hire or transfer and every two years thereafter.
Preferred Qualifications:
Expertise in CAD software (e.g. PTC Creo) understanding of mechanical design principles fluid dynamics heat transfer manufacturing processes and validation.
Working knowledge of cloud infrastructure data center operations and related technologies such as server racks power distribution cooling systems and cable management.
Prior development experience of liquid cooled AI or HPC systems.
Experience with development of specifications interface control documents and managing design requirements.
Proven analytical and problem-solving skills with the ability to identify and resolve mechanical design issues and optimize system performance.
Experience with cabling and networking interconnect technology.
Experience partnering with ODM and suppliers to develop products.
Mechanical Engineering IC5 - The typical base pay range for this role across the U.S. is USD $142800 - $274800 per year. There is a different range applicable to specific work locations within the San Francisco Bay area and New York City metropolitan area and the base pay range for this role in those locations is USD $188000 - $304200 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
position will be open for a minimum of 5 days with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age ancestry citizenship color family or medical care leave gender identity or expression genetic information immigration status marital status medical condition national origin physical or mental disability political affiliation protected veteran or military status race ethnicity religion sex (including pregnancy) sexual orientation or any other characteristic protected by applicable local laws regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process read more about requesting accommodations.
Required Experience:
IC
