Mechanical Engineer

Job Description

We are seeking a highly motivated Mechanical Engineer with strong expertise in thermal and thermal mechanical simulations solder materials and attach processes wire bond process and epoxy materials to support the design development and reliability of advanced products. This role will focus on thermal management materials selection and process development to ensure robust performance and manufacturability.

The ideal candidate will have hands-on experience with thermal modeling tools a deep understanding of heat transfer and practical knowledge of soldering and adhesive systems used in high-performance assemblies.

Key Responsibilities

* Perform thermal simulations and analyses (steady-state and transient) to optimize product performance and reliability

* Develop and validate thermal models using tools of Solidworks Simulation (FEA) Solidworks Flow Simulation (CFD) or equivalent tools experiences such as ANSYS COSMCOL etc.

* Design and evaluate thermal management solutions (heat sinks interfaces TIMs cooling strategies)

* Lead or support solder attach process development including die attach component attach and reflow processes

* Support wire bond process development by defining tools wires and process parameters to meet product performance and reliability requirements.

* Select and qualify epoxies and adhesive materials for structural bonding encapsulation and thermal interface applications

* Collaborate with cross-functional teams (electrical materials manufacturing reliability) to ensure design integration.

* Conduct failure analysis and root cause investigations with a focus on thermal and material-related issues

* Define and execute design validation tests (DVT) including thermal cycling shock and environmental testing

* Support manufacturing scale-up by developing process specifications work instructions and quality criteria

* Analyze test data and provide recommendations for design and process improvements

Required Qualifications

* Bachelors or Masters degree in **Mechanical Engineering** or related field

* 3-8 years of relevant industry experience

* Strong understanding of heat transfer principles (conduction convection radiation) and key factors of a real thermal system to be able to convert it to a solvable model and get a desired accurate result.

* Hands-on experience with thermal simulation tools (e.g. Solidworks Simulation SolidWorks Flow Simulation ANSYS COMSOL)

* Experience with solder attach processes (die attach SMT reflow profiles reliability concerns such as intermetallic compound formation voiding fatigue)

* Knowledge of epoxies and adhesives including material properties curing mechanisms and application methods

* Knowledge of hermetic packages hermeticity definition as well as how to design it manufacture it and test it.

* Familiarity with thermal interface materials (TIMs) and packaging concepts

* Experience with lab testing and instrumentation (thermocouples IR cameras data acquisition)

* Strong analytical and problem-solving skills

Preferred Qualifications

* Experience in semiconductor packaging optoelectronics or high-power electronics

* Knowledge of DFM (Design for Manufacturability) and DFR (Design for Reliability)

* Background in finite element analysis (FEA) for structural and thermo-mechanical modeling

* Understanding of materials reliability including CTE mismatch fatigue and creep

* Experience with failure analysis techniques (cross-sectioning microscopy)

* Familiarity with industry standards (MIL ISO IATF)

* Programming or scripting skills (Python MATLAB JMP) for data analysis

* Experience working in a fast-paced cross-functional development environment

Key Competencies

* Strong technical depth in thermal and materials engineering

* Ability to translate simulation results into practical design improvements

* Effective communication and collaboration skills

* Detail-oriented with a focus on quality and reliability

* Self-driven and capable of managing multiple priorities

The full-time base salary range for the Mechanical Engineer position is $93000 to $110000 per annum. The range reflects the minimum and maximum possible base salary for new hires for the role based on the advertised location. Individual pay is determined by several factors including work location job-related skills experience and relevant education and training. For more information about the base salary range applicable to the work location talk to the recruiter.

Kyocera SLD Laser Inc. is an equal opportunity employer. We do not discriminate on the basis of race color religion sex (including pregnancy childbirth or related medical conditions) gender identity gender expression national origin ancestry citizenship age physical or mental disability legally protected medical condition military or veteran status marital status domestic partner status sexual orientation genetic information or any other basis protected by local state or federal laws

The above statements are intended to describe the general nature and level of work being performed by people assigned to this job. They are not intended to be an exhaustive list of all responsibilities duties and requirements of personnel as classified.