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Mac Reliability Engineer
Job Location:
Job Location:
Austin, TX - USA
Monthly Salary:
Not provided by the employer
Monthly Salary:
Posted:
5 September 2026 (16 hours ago)
Posted:
Application Deadline:
3 December 2026
Application Deadline:
Vacancies:
1 Vacancy
Vacancies:
Job Summary
Do you ever wonder what goes into making Apple products an amazing user experience The engineers on Apples innovative reliability team are responsible for insuring that our products exceed our customers expectations for robustness durability and reliability. We are looking for talented contributors who enjoy working on revolutionary products and aspiring to make them better through creation and execution of comprehensive test suites identification of potential failure modes and collaboration with design teams to drive product improvements.
The position is on Apples innovative Mac Reliability Engineering team where we collaborate with hardware development and Silicon packaging. The engineer will be responsible for leading board level reliability on new Mac portables development of new test procedures to quantify the reliability of a design and failure analysis resulting from these tests.
Preparing concise and detailed test plans and test reportsnStatistical data analysis to provide risk assessments of a designnResearching a technology to determine possible failure modesnPrioritizing and completing tasks to meet deadlinesnProviding design input to improve product reliability when necessarynInteracting with a wide variety of individuals and teams to communicate results
MS in Materials Science Electrical Mechanical Engineering or an equivalent field with 2 years of relevant engineering experiencenExperience performing board level reliability testing including Mechanical Stress Tests Shock/Drop/Vibration Testing Environmental TestingnAbility to use fundamental failure analysis methodology to derive root cause of failures knowledge of failure modes and statistical life data analysis using curve fitting and distributions modelsnKnowledge of board level design DFM (Design for Manufacturing) and reliability best practices to guide component selection and placement in early architecturenStrong knowledge of Semiconductor package integration SLI (Second Level Interconnect) reliability passive components reliability bonding materials and warpage controlnAbility to apply FMEA (Failure Modes an Effects Analysis) methodologies
Application of DOE (design of Experiments)nFailure Analysis analytical techniques (Optical Microscopy X-Ray CSAM SEM/EDS FTIR XPS etc)nKnowledge of industry test Standards (JEDEC ASTM IEEE)nExceptional problem solving abilities written and verbal communication skills and strong attention to detailnAbility to manage multiple projects at the same timenDynamic and can do attitude with a desire to work with a great team and productnAbility to travel internationally without restrictions
The position is on Apples innovative Mac Reliability Engineering team where we collaborate with hardware development and Silicon packaging. The engineer will be responsible for leading board level reliability on new Mac portables development of new test procedures to quantify the reliability of a design and failure analysis resulting from these tests.
Preparing concise and detailed test plans and test reportsnStatistical data analysis to provide risk assessments of a designnResearching a technology to determine possible failure modesnPrioritizing and completing tasks to meet deadlinesnProviding design input to improve product reliability when necessarynInteracting with a wide variety of individuals and teams to communicate results
MS in Materials Science Electrical Mechanical Engineering or an equivalent field with 2 years of relevant engineering experiencenExperience performing board level reliability testing including Mechanical Stress Tests Shock/Drop/Vibration Testing Environmental TestingnAbility to use fundamental failure analysis methodology to derive root cause of failures knowledge of failure modes and statistical life data analysis using curve fitting and distributions modelsnKnowledge of board level design DFM (Design for Manufacturing) and reliability best practices to guide component selection and placement in early architecturenStrong knowledge of Semiconductor package integration SLI (Second Level Interconnect) reliability passive components reliability bonding materials and warpage controlnAbility to apply FMEA (Failure Modes an Effects Analysis) methodologies
Application of DOE (design of Experiments)nFailure Analysis analytical techniques (Optical Microscopy X-Ray CSAM SEM/EDS FTIR XPS etc)nKnowledge of industry test Standards (JEDEC ASTM IEEE)nExceptional problem solving abilities written and verbal communication skills and strong attention to detailnAbility to manage multiple projects at the same timenDynamic and can do attitude with a desire to work with a great team and productnAbility to travel internationally without restrictions
Required Experience:
IC
About Company
Ask Siri to name the most successful company in the world and it might respond: Apple. And it's not just out of familial pride. Apple consistently ranks highly in profit, revenue, market capitalization, and consumer cachet. In 2018, the company became the first reach a trillion dollar ... View more
