Lead Principal IC Packaging Design Engineer

Location: Chandler Arizona OR Hillsboro Oregon (Onsite)

Employment: Long-Term Contract (12 Months)

Experience: 10 Years

We are seeking a Lead IC Packaging Design Engineer with extensive experience in advanced semiconductor package development. This role will lead package implementation guide complex substrate designs collaborate with architecture SI/PI manufacturing and reliability teams and drive high-quality package solutions from concept through production.

• Lead advanced semiconductor package design projects.
• Drive complete package implementation using Siemens Xpedition or Cadence APD.
• Define substrate architecture and layout strategy.
• Lead SI/PI-aware package implementation.
• Ensure package manufacturability yield and reliability.
• Review package floorplans and routing methodologies.
• Drive design rule compliance across projects.
• Collaborate with architecture manufacturing and reliability teams.
• Resolve complex package design challenges.
• Mentor package design engineers.
• Support customer reviews and technical discussions.
• Contribute to package design process improvements and best practices.

• Bachelors or Masters degree in Electrical/Electronics Engineering.
• 10 years of IC Packaging Design experience.
• Proven experience leading advanced package design programs.
• Strong knowledge of package architecture substrate design and package implementation.

• Siemens Xpedition (Mentor Graphics XPD)
• Cadence APD
• Cadence Allegro
• Cadence SiP

• Package Architecture
• High-Density Substrate Design
• Advanced Package Layout
• Flip Chip
• Multi-Chip Package Design
• SiP Package Design

• Physical Package Design
• SI/PI Optimization
• Reliability Engineering
• Yield Improvement
• Design Rule Compliance
• Design for Manufacturability (DFM)

• Technical Leadership
• Design Reviews
• Engineering Mentorship
• Cross-functional Collaboration