Electromechanical Integration Engineer Air Vehicles
Job Location:
Costa Mesa, CA - USA
Yearly Salary:
Posted:
Application Deadline:
Vacancies:
Job Summary
ABOUT THE TEAM
WHAT YOULL DO
- Design flight-critical enclosures chassis and mechanical packaging for high-density circuit card assemblies battery systems electro-optical payloads and cable/harness assemblies.
- Collaborate with electrical engineers to inform PCBA layout define connector configurations manage keep-out zones route harnesses and establish thermal and grounding interfaces.
- Create detailed 3D models drawing packages and GD&T and tolerance stack-up analyses to ensure designs are optimized for assembly serviceability and high-yield manufacturing.
- Conduct hand calculations and structural FEA working with thermal and fatigue analysts to validate performance before committing to physical hardware.
- Design hardware to survive aerospace environmentsvibration shock thermal extremes moisture and EMI/EMCmeeting standards such as MIL-STD-810 MIL-STD-464/461 and DO-160.
- Lead root-cause investigations and corrective actions for mechanical environmental or manufacturing anomalies found during qualification or flight operations.
- Support design reviews (PDR/CDR) and drive execution of engineering deliverables across distributed cross-functional teams including systems hardware software manufacturing test and supply chain.
- B.S. or higher in Mechanical Engineering Mechatronics Aerospace Engineering or equivalent experience.
- 4 years of experience in electronics packaging and/or electromechanical systems design in aerospace defense automotive or robotics.
- Direct experience designing hardware to MIL-STD-810 and MIL-STD-464/461 environmental and EMI/EMC standards.
- Proficiency with 3D CAD (Siemens NX SolidWorks CATIA or similar) for complex surface modeling enclosure packaging and harness routing.
- Understanding of advanced manufacturing processes including CNC machining sheet metal fabrication casting injection molding and 3D printing with hands-on prototyping experience.
- Strong communication collaboration and teamwork skills across multi-site multi-disciplinary teams.
- Eligible to obtain and maintain an active U.S. Secret security clearance.
- Extensive experience with Siemens NX and Teamcenter.
- Familiarity with eCAD tools (Altium Cadence Allegro) and harness design software (Siemens Capital Zuken E3).
- Practical understanding of bare-board PCB manufacturing high-density interconnect (HDI) stackups and SMT assembly standards (IPC-A-610/J-STD-001).
- Advanced FEA and thermal simulation experience with tools such as Ansys Mechanical Ansys Icepak FloTHERM or Ansys Sherlock.
- Experience designing battery modules/packs or precision-aligned electro-optical/sensor payloads.
- Active Top Secret DoD clearance.
US Salary Range
$129000 - $171000 USD
The salary range for this role is an estimate based on a wide range of compensation factors inclusive of base salary only. Actual salary offer may vary based on (but not limited to) work experience education and/or training critical skills and/or business considerations. Highly competitive equity grants are included in the majority of full time offers; and are considered part of Andurils total compensation package. Additionally Anduril offers top-tier benefits for full-time employees including:
At Anduril we invest in our people. Our comprehensive competitive benefits package (available at little to no cost to employees) ensures youre supported in health recovery and whatever comes next.For more information Explore Our Benefits.
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Required Experience:
IC
