Director Pathfinder Solutions Integrated Materials Solutions

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the worlds technology.

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Role Summary

The Director Pathfinding Solutions will serve as a deep technical leader and hands-on contributor who develops next-generation semiconductor process solutions spanning logic and memory device architectures. This individual will operate at the intersection of process engineering device physics and materials science working across Applieds product Business Units to assemble and de-risk integrated pathfinding solutions for N1 N2 and beyond technology nodes.

This is a technically distinguished individual contributor role at the E5 / Director level. The ideal candidate is a recognized expert in advanced semiconductor process integration someone who can independently conceive develop and demonstrate pathfinding solutions engage credibly with customer technologists at senior levels and influence Applieds product roadmaps through deep technical insights. This is not a traditional people management role; it is a technical leadership position that demands world-class expertise creativity and execution.

Key Responsibilities

Pathfinding Solution Development

• Develop and demonstrate integrated pathfinding process solutions for advanced logic (GAA CFET) and / or memory (DRAM 4F2 3D DRAM NAND) device architectures

• Drive hands-on process development spanning deposition etch implant epitaxy CMP and thermal processing connecting individual process steps into integrated module flows

• Identify and de-risk critical process challenges for N1 and N2 (solving integration problems) technology nodes through systematic experimentation and DTCO (Design-Technology Co-Optimization) analysis

• Translate customer device performance targets (e.g. contact resistance reduction carrier mobility enhancement low-k integration high-selectivity etch) into actionable Applied process solutions

Cross-BU Technical Integration

• Work across Applieds product BUs to assemble end-to-end process flows that demonstrate Applieds differentiated value

• Partner with BU development teams to influence product roadmaps based on pathfinding learnings and customer requirements

• Collaborates with DTCO for integration-level analysis that connects individual process capabilities to device-level performance metrics (Vt Idsat leakage RC delay capacitance resistance strain thermal NAND)

• Coordinate wafer flow DOE design and data analysis across multiple BU tools and process modules

Customer Technical Engagement

• Engage directly with senior technologists at key customers (Samsung Intel TSMC SK Hynix Micron etc) as a credible technical peer presenting data discussing integration approaches and aligning on pathfinding priorities

• Lead technical discussions in customer Technology Review Meetings (TRMs) performance task forces and pathfinding workshops

• Translate customer integration challenges into Applied-actionable development programs and demo plans

• Support customer co-development engagements by providing deep process expertise and integration guidance

Technical Thought Leadership

• Publish at premier conferences (IEDM VLSI ISSCC IRPS) and in top journals to establish Applieds technical leadership in pathfinding

• Build a strong patent portfolio in advanced process integration and pathfinding solutions

• Contribute to Applieds internal technical community through seminars reviews and mentoring of junior engineers

• Stay at the forefront of semiconductor technology trends including device architecture evolution new materials and emerging integration challenges

Qualifications

Required

• Ph.D. in Electrical Engineering Materials Science Chemical Engineering Physics or a related semiconductor discipline

• 10 years of experience in semiconductor process development integration or device engineering with deep expertise in FEOL MOL or BEOL process technologies

• Demonstrated hands-on track record of developing integrated process solutions for advanced logic and/or memory nodes

• Strong publication record at top-tier semiconductor conferences (IEDM VLSI IRPS) and/or a significant patent portfolio

• Experience engaging directly with customer technical teams at major semiconductor manufacturers (IDMs foundries memory makers)

• Deep understanding of device physics process-structure-property relationships and DTCO principles

• Ability to work effectively across organizational boundaries coordinating with multiple BUs product teams and customer organizations

• Exceptional analytical problem-solving and communication skills

Preferred

• Experience collaborating with or working at a semiconductor equipment or materials company with exposure to multiple process technologies

• Track record as a Distinguished Member of Technical Staff (DMTS) or equivalent technical leadership designation

• Experience with advanced device architectures including Gate-All-Around (GAA) Complementary FET (CFET) 3D DRAM or 4F2 DRAM NAND

• Familiarity with advanced metallization (Mo Cu W etc.) selective processes and novel patterning approaches

• Prior experience at a leading semiconductor manufacturer in a process integration or device engineering role

• Strong network in the semiconductor technical community

What Sets This Role Apart

This is not a management or strategy role it is a deeply technical hands-on position for someone who thrives on solving the hardest process integration challenges in the semiconductor industry. The ideal candidate will mirror the profile of our top-performing technical leaders who:

• Own end-to-end pathfinding solutions from concept through customer demonstration

• Are recognized as go-to technical experts by both internal teams and external customers

• Can independently drive complex multi-BU process development programs

• Combine deep domain expertise with broad integration thinking

• Elevate Applieds technical brand through publications patents and customer engagements

• Operate with high autonomy and impact at the intersection of technology and customer value

Additional Information

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The salary offered to a selected candidate will be based on multiple factors including location hire grade job-related knowledge skills experience and with consideration of internal equity of our current team addition to a comprehensive benefits package candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program as applicable.

For all sales roles the posted salary range is the Target Total Cash (TTC) range for the role which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.

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