ASIC Package Design Manager

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Job Description:

Broadcom is seeking an experienced IC Package Design Manager to lead a team of engineers designing complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI) networking high-performance computing (HPC) and 5G base designs include SerDes at 448G and higher 5G RF/Microwave ADC/DAC HBM DDR5 and this role you will support and develop the engineering team as well as contribute to technical methodologies and project management.

RESPONSIBILITIES:

• Understand the skill sets and traits of each team member in order to maximize productivity and retention

• Project Management : Create and track project plans for 20 concurrent designs (scope schedules resources)

• Organize team & customer activities to keep projects on track

• Communicate plans status next steps and risks

• Create technical methodologies for package design

• Steering package technology and design rules with input from team members

• Customer vendor & cross-functional collaboration

EDUCATION/EXPERIENCE & REQUIREMENTS:

• Preferred candidates have previous experience managing people and projects

• BSEE/MSEE or similar field and 12 years of experience in flip-chip-BGA package design including high-speed SerDes with a minimum of 3 years in management

• Knowledge of package-level signal integrity and power integrity to apply to package designs

• Cooperate with our world-wide team (multiple time zones) including co-design with internal team members and external (Vendor) designers

• Self-management and organization skills

• Technical understanding related to package design:

  • Package-Design lifecycle

  • How the substrate and package fit into the overall ASIC design and manufacturing flows

  • Design Data including how it is created and used: .mcm package spreadsheet drawings (POD Lid Substrate)

  • DFx trade offs (Design for x where is x is manufacturability reliability assurance of supply SI/PI etc)

  • Layout

  • SI/PI extractions and Simulations

  • Automation code development

  • Mechanical & Thermal modeling

  • Project Management

  • New Business Quotes

OTHER REQUIREMENTS

• This job requires working on-site at the Broadcom office 5 days a week. This is not a remote-work position

• Occasional travel may be required

Compensation and Benefits

As a valued member of our team youll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant but also annual equity awards connecting your success directly to the companys growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical dental and vision plans 401(K) participation including company matching Employee Stock Purchase Program (ESPP) Employee Assistance Program (EAP) company paid holidays paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race color creed religion sex sexual orientation national origin citizenship disability status medical condition pregnancy protected veteran status or any other characteristic protected by federal state or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA please be sure to fill out a home address as this will be used for future correspondence.