Mechanical Engineer Microelectronic Products

• Lead new product introduction activities from prototype through qualification production release and manufacturing ramp-up.
• Perform thermal and stress analysis to assess heat transfer operating temperatures thermal expansion and stresses under thermal and mechanical loading using results to guide material selection packaging and assembly design.
• Develop and review mechanical designs drawings tolerances and material specifications for microelectronic assemblies housings and associated tooling.
• Work with electronic and reliability engineers to address thermal and mechanical risks including material compatibility and stresses caused by temperature cycling.
• Lead manufacturing design and production-readiness reviews ensuring products are suitable for assembly inspection and test.
• Plan and support prototype and pilot builds using physical testing to validate analysis and resolve design or manufacturing issues.
• Define and coordinate manufacturing processes tooling work instructions and supplier readiness maintaining configuration and engineering change control.
• Own the handover into production and support early manufacturing until agreed quality yield and process stability requirements are achieved.

• Degree or equivalent practical experience in Mechanical Engineering or a related discipline.
• Experience in mechanical design manufacturing engineering or new product introduction including transferring products from development into production.
• Practical experience performing thermal and stress analysis and interpreting results to inform engineering decisions.
• Proficiency in SOLIDWORKS for 3D modelling and engineering drawings and SOLIDWORKS Simulation for thermal and stress analysis with a good understanding of dimensional tolerances and assembly requirements.
• Good understanding of heat transfer thermal expansion material properties and their effects on product performance.
• Experience with design for manufacture and assembly process validation and structured root cause analysis.
• Ability to plan and support practical testing compare results with predictions and resolve discrepancies.
• Strong communication and coordination skills with experience working across engineering manufacturing quality and supplier teams.

Desirable Experience

• Experience with microelectronics electronic packaging hybrid assemblies ceramic substrates die attach or wire bonding.
• Experience with finite element analysis for thermal stress vibration or other mechanical loading.
• Experience developing products for high-temperature or harsh-environment applications.
• Familiarity with process FMEA control plans process qualification and manufacturing-readiness assessments.
• Experience with specialist materials adhesives joining methods or sealed electronic packages.

Other Requirements

• Eligibility for full security clearance.
• Occasional travel to company facilities suppliers customers and external test laboratories.

Equal Opportunity Employer/Protected Veterans/Individuals with Disabilities

The contractor will not discharge or in any other manner discriminate against employees or applicants because they have inquired about discussed or disclosed their own pay or the pay of another employee or applicant. However employees who have access to the compensation information of other employees or applicants as a part of their essential job functions cannot disclose the pay of other employees or applicants to individuals who do not otherwise have access to compensation information unless the disclosure is (a) in response to a formal complaint or charge (b) in furtherance of an investigation proceeding hearing or action including an investigation conducted by the employer or (c) consistent with the contractors legal duty to furnish information. 41 CFR 60-1.35(c)

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