Senior Power Module Process Engineer

Job Title: Senior Power Module Process Engineer

Job Summary

Our client is seeking an experienced Senior Power Module Process Engineer to support the development and manufacturing of advanced semiconductor power-module products. The successful candidate will lead process characterization establish critical manufacturing controls and collaborate with cross-functional engineering teams to improve product quality reliability cost and production performance.

Key Responsibilities

• Conduct Design of Experiments (DOE) and process characterization for critical power-module manufacturing processes.
• Define process materials operating parameters tooling controls and handling procedures.
• Develop and maintain process-design guidelines control plans and manufacturing specifications.
• Work closely with Process Engineering Equipment Engineering Quality Product Management and other technical teams.
• Troubleshoot complex manufacturing and product-quality issues.
• Analyse engineering and production data using statistical methods.
• Support process optimization yield improvement reliability improvement and defect-reduction initiatives.
• Participate in cost-reduction projects related to power-module products.
• Prepare technical reports and communicate findings to internal stakeholders.

Qualifications and Experience

• Bachelors degree or higher in Electronics Electrical Engineering Mechanical Engineering Materials Engineering Chemical Engineering Industrial Engineering or a related field.
• At least five years of relevant experience in semiconductor assembly power modules wafer-level packaging IC packaging or electronic-module manufacturing.
• Practical experience in product or process development material selection assembly or package reliability.
• Strong knowledge of engineering data analysis SPC DOE APQP and FMEA.
• Candidates must have detailed practical knowledge of at least two or three of the following processes:
• Advanced SMT including high-density multilayer or double-sided component assembly.
• Silver or copper sintering including pressure and pressureless sintering.
• Soft-solder die attach.
• Aluminium or aluminium-copper wedge and ribbon bonding.
• Vacuum or formic-acid reflow.
• Advanced flip-chip processes including multi-die stacked-die fine-pitch flip chip and thermo-compression bonding.
• Capillary underfill for fine-pitch flip-chip or thermo-compression bonding applications.
• Advanced copper-clip processes including exposed copper clips.
• Heat-sink or heat-slug attachment.
• Advanced moulding including double-sided moulding low-wire-sweep moulding liquid moulding and compression moulding.
• Low-stress blade or laser-singulation processes.

Key Copetencies

• Strong analytical and structured problem-solving skills.
• High level of responsibility and attention to detail.
• Quality-focused mindset with a strong commitment to zero-defect manufacturing.
• Effective cross-functional communication and coordination skills.
• Good command of English.