TWPackaging Development Engineer (ASIC)

We are seeking a motivated skilled and curious Semiconductor Packaging Engineer to support the development of innovative automotive-grade ASIC products. This role serves as a key bridge between internal cross-functional partners and external assembly/test suppliers (OSATs). The ideal candidate combines technical packaging expertise with strong supplier management skills a collaborative mindset and a passion for continuous learning.

In this role you will define develop and qualify robust packaging solutions. Your core tasks include: 

• Package Design & Process Development: Drive design material selection and optimize assembly processes in close collaboration with external suppliers and internal cross-functional teams. 

• Design & Risk Assessment: Participate in design risk reviews and Failure Mode and Effects Analyses (FMEAs) to mitigate assembly risks. 

• OSAT & Supplier Management: Manage OSAT partners to overview manufacturing and processes track project timelines and ensure effective quality control. 

• NPI & Process Qualification: Monitor prototyping runs and formal qualifications. Ensuring adherence to automotive standards (e.g. AEC-Q100 Q006). 

• Global Collaboration: Act as the technical interface to align packaging and assembly requirements with international design test and quality management teams. 

Qualifications :

Technical Experience & Capabilities 

• Education & Experience: Masters degree in Electrical Engineering Materials Science Mechanical Engineering Physics or related disciplines with 3 years of experience in semiconductor packaging engineering. 

• Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN QFP SOIC Flip-chip BGA SiP). 

• Problem-Solving Skills: Strong analytical skills to work systematically to solve complex technical challenges. (e.g. 8D statistic etc) 

• Supplier Management: Proven ability to steer collaboration with external suppliers 

Language & Travel Requirements 

• Language Skills: Excellent English (verbal and written min. C1 level) for international collaboration paired with professional Mandarin Chinese for technical discussions with local teams and regional suppliers. 

• Travel: Flexibility to travel to overseas supplier sites and OSAT manufacturing facilities according to project needs. 

Remote Work :

No

Employment Type :

Full-time