Senior Manufacturing Engineer

MACOM designs and manufactures semiconductor products for Data Center Telecommunication and Industrial and Defense applications. Headquartered in Lowell Massachusetts MACOM has design centers and sales offices throughout North America Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 65 years of application expertise with multiple design centers Si GaAs and InP fabrication manufacturing assembly and test and operational facilities throughout North America Europe and Asia. Click here to view our addition MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

MACOM is an Equal Opportunity Employer.

We consider applicants for all positions without regard to race color religion creed gender national origin age disability marital status or veteran status or any other legally protected status.

Manufacturing Engineer InP Photodiode WAT Assembly

Location: Hsinchu Taiwan
Company: MACOM
Manufacturing Site: Subcontract / OSAT partner(frequent onsite support required)

About the Role

MACOMis seeking a Manufacturing Engineer based in Hsinchu Taiwan to support the wafer acceptance and WAT(Wafer Acceptance Test) assembly process for Indium Phosphide (InP) photodiode devices manufactured at a subcontract backend partner.
Thisrole provides technical and manufacturing oversight of key assembly steps including photodiodedie attach to carrier (CoC) die shear testing and CoC die attach into QFNpackages. While production is executed at thesubcontract site the engineer will act as MACOMs primarytechnical interface ensuring stable output strongyield performance and continuous improvement in a highvolumemanufacturing environment.
Theposition combines handson process engineering with manufacturing execution and supplierengagement and requires regular presence at thesubcontract manufacturing site.

Key Responsibilities

Provide technical oversight of the InP photodiode wafer acceptance assembly process.
Support and troubleshoot CoC die attach die shear testing and QFN assembly processes.
Maintain process stability using SPC control plans and standard work.
Work closely with subcontractor operations to support capacity alignment throughput improvement and cycle time reduction.
Lead root cause analysis for yield mechanical integrity and assemblyrelated issues.
Act as MACOMs technical interface with the subcontract partner supporting issue resolution and execution discipline.
Support NPI engineering builds technology transfers and continuous improvement initiatives.
Train subcontractor engineers and technicians on process best practices handling and yield optimisation.
Track manufacturing KPIs and drive yield cost and productivity improvements.
Work with internal cross functional teams to disposition and determine root cause of failing wafers.

Qualifications

Bachelors degree in Materials Science Mechanical Engineering Electrical Engineering Physics or related field.
36 years of experience in semiconductor backend manufacturing or assembly engineering.
Experience with die attach processes mechanical testing (die shear) and QFN or leadframebased packages.
Exposure to InP IIIV materials photodiode laser or optoelectronic devices is strongly preferred.
Familiarity with OSAT or supplierbased manufacturing environments.
Strong analytical and structured problemsolving skills.
Experience using JMP Minitab Power BI or similar data analysis tools.
Strong English communication skills.
Willingness to travel regularly to subcontract manufacturing sites and work handson in production environments.

Required Experience:

Senior IC