Fellow, Advanced Packaging
Taichung City - Taiwan
Job Summary
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.
Our vision is to transform how the world uses information to enrich life forall.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.
Fellow Advanced Packaging
Role Summary
The Fellow Advanced Packaging serves as Microns apex technical authority for advanced packaging technologies driving breakthrough innovations that enable world-leading AI-first products and next-generation heterogeneous integration platforms. This role owns the3-10 yeartechnology roadmap identifies technology inflection points and anticipates fundamental barriersto success.
The Fellow partners with senior leadership to inform corporate packaging strategy solves the most critical technical challenges mentors the next generation of packaging technologists and elevates Microns global technical leadership in advanced packaging.
Key Responsibilities
Define and own310-year technology roadmap; identify technology inflection points
Anticipate and solve long range fundamental technology barriers interconnect scaling hybrid bonding yield thermals warpage reliability and defectivity with multi-die complexes
Partner with senior leadership and technologists to inform corporate level packaging strategy and investment priorities
Breakthrough problemsolving forcritical technical roadblocks
Mentor and develop next generation of advanced packaging technologists
Champion a culture of technical rigor innovation intellectual curiosity and decision frameworks
Generate high-value IP in advanced interconnect architectures and materials and process innovations
Incubate next-generation platform technologies
Required Qualifications
Ph.D. in Materials Science and Engineering Electrical Engineering or related technical field required
Minimum 15 years of technical experience in advanced semiconductor packagingtechnologieswith demonstrated expertise inprocesses such ashybrid bonding 3D integration heterogeneous integration and interconnect scaling
Proven track record developing and implementing breakthrough packaging technologies from research through high-volume manufacturing
Experience defining long-term technology roadmaps and informing corporate-level investment strategy for next-generation packaging platforms
Demonstrated ability to mentor and develop technical talent with measurable impact on engineering capability
Theability to bridge fundamental researchtoproduction implementationis critical.
Leadershippositions in major professional societies and/orexperience as strategic advisorin either the private or public sector is preferred
About Micron Technology Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.
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Micron Prohibits the use of child labor and complies with all applicable laws rules regulations and other international and industry labor standards.
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About Company
Explore Micron Technology, leading in semiconductors with a broad range of performance-enhancing memory and storage solutions