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Equipment Engineer

NXP Semiconductors


Job Location:

Kaohsiung City - Taiwan

Monthly Salary: Not provided by the employer
Posted: 6 June 2026 (30+ days ago)
Application Deadline: 3 September 2026
Vacancies: 1 Vacancy
The job posting is outdated and position may be filled

Job Summary

Equipment engineer with ME/EE background to fulfill tasks below.

1. Design wire bond related parts / tool

2. Rationalize machine preventive maintain frequency

3. Cooperate with process engineer to evaluate new wire bond machine

4. Training line repair technician

5. Spare parts lifetime evaluation and safety stock management

6. Standardize machine repair procedure

7. Capability to overhaul wire bond machine

8. Cooperate with IT for production system build up and sustain


More information about NXP in Greater China...

#LI-2370

Required Experience:

IC


About Company

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NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.

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