Die Bond Process Engineer

**Key Responsibilities**
- Assist in establishing and maintaining the Die Bond process
- Monitor daily production to ensure process stability yield and quality performance
- Conduct root cause analysis (RCA) of process issues and implement corrective and preventive actions
- Support new product introduction (NPI) including process setup validation and documentation
- Optimize process parameters to improve yield efficiency and reliability
- Collaborate with cross-functional teams (e.g. Production Equipment Quality Innovation)
- Analyze data and prepare process reports
- Participate in continuous improvement projects (e.g. cost reduction capacity increase)

**Education & Qualifications**
- Bachelors or Masters degree in a related field including:
- Materials Science
- Chemical Engineering
- Mechanical Engineering
- Electrical / Electronic Engineering
- Basic knowledge of semiconductor packaging processes is preferred
- Strong analytical and problem-solving skills
- Good communication skills and a team-oriented mindset
- English proficiency: TOEIC score of 650 or above or equivalent certification

More information about NXP in Greater China...