2026 Internship Program Process Engineer Intern (Wire Bonding)

NXP Semiconductors

Job Location:

Kaohsiung City - Taiwan

Monthly Salary: Not Disclosed

Posted on: 7 days ago

Vacancies: 1 Vacancy

Job Summary

To work with operation/maintenance to ensure production smoothly.
To assist action confirmations with system monitors.
To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator.

Job Qualification:

Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures
Bachelors or Masters student in Material/Science/Electronic Engineering or related
Available to work at least 3 days/week.
Good verbal and written English communication skills
MS Office or Programming skill
Self-motivated results oriented willing and eager to learn proactive attitude

More information about NXP in Greater China...

#LI-2370

Required Experience:

Intern

To work with operation/maintenance to ensure production smoothly.To assist action confirmations with system monitors.To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator.Job Qualification:Understanding of Plasma cleaning principle for wire b...