Senior FA Engineer
Job Location:
Job Location:
Kuala Lumpur - Malaysia
Monthly Salary:
Not Disclosed
Monthly Salary:
Posted on:
11 days ago
Posted on:
Vacancies:
1 Vacancy
Vacancies:
Job Summary
- Utilize a wide variety of sample preparation techniques and imaging tools including but not limited to chemical processing die extraction die physical polishing RIE MIP X-Prep cross-sectioning wire bonding repackaging ion polishing SEM/EDX and backside IR.
- Operate precision milling/polishing systems and Reactive Ion Etching (RIE) systems for high-precision site-specific sample preparation for package-level electrical FA (EFA) and die-level physical FA (PFA).
- Perform die extraction for various package types and execute layer-by-layer polishing at the die level.
- Conduct sample preparation through grinding/polishing chemical processing and repackaging techniques.
- Document analysis results thoroughly including detailed observations conclusions and recommended corrective actions.
- Contribute to the development of new FA techniques methodologies and recipes as well as tool evaluation projects to support emerging technologies.
- Demonstrate a strong understanding of semiconductor manufacturing processes.
Job Qualifications
- Bachelors or Masters degree in Materials Science Physics Analytical Chemistry or a related field.
- Proven experience (3 years) in a semiconductor manufacturing or R&D environment; Wafer Fab experience is a plus.
- Hands-on experience with a broad range of FA sample preparation tools and techniques.
- Strong theoretical and practical knowledge of semiconductor device processing and packaging technologies.
Required Experience:
Senior IC
About Company
NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
