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Plating Process Engineer

NXP Semiconductors


Job Location:

Kuala Lumpur - Malaysia

Monthly Salary: Not provided by the employer
Posted: 22 August 2026 (10 days ago)
Application Deadline: 19 November 2026
Vacancies: 1 Vacancy

Job Summary

Responsibilities

  • Provide process support for Electroplating processes

  • Drive Continual process improvement activities to improve the productivity and capacity

  • Work closely with maintenance and equipment engineering to trouble shoot issues develop maintenance plans recommend tooling upgrades etc.

  • Generate and maintain process documentation

  • Provide technical support and training to production personnel

  • Lead the New Developments/Projects liaise with vendors on the new products and tooling developments

  • Design and fabricate new tooling for the existing/new products

  • Troubleshooting / maintaining the plating line

  • Assist in Implementation of action plan to reduce production scrap and quality issues

  • Engage in process and productivity improvement

  • Organize working groups to solve Quality problems / Continuous improvement when necessary

  • Ensure that corrective and preventive actions are carried out as per the plan

  • Monitor process stability and process capability values

  • Provide the weekly or monthly reports to management

  • Support maintenance team to run the Waste water treatment plant operations

  • Track and improve team performance

  • Other duties as assigned by Management

Requirements

Candidate must possess a Bachelors Degree in Engineering (Chemical / Mechanical) or equivalent

2 to 3 years of related working experience. Fresh graduates are encouraged to apply.

Candidate must be comfortable to work in a chemical environment


More information about NXP in Malaysia...

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Required Experience:

IC


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NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.

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