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Packaging Development Engineer

NXP Semiconductors


Job Location:

Kuala Lumpur - Malaysia

Monthly Salary: Not provided by the employer
Posted: 16 July 2026 (30+ days ago)
Application Deadline: 13 October 2026
Vacancies: 1 Vacancy

Job Summary

Responsibilities:

  • Lead plan andexecute projects related to processassembly development andvalidation
  • Design execute and analyze process related experiments
  • Use software to analyze data including statistical analysis
  • Solveprocess issues usingcreative problem solving techniques
  • Create process recipe for packaging development qualifyand transfer forhigh volume production
  • Set upnewspecifications and procedures for production
  • Initiate sharing of lesson learnt and best practices among manufacturing sites
  • Lead / participate in Task Force Teams
  • Identify risks and actions for risk mitigation manufacturing operation
  • Lead / support process qualification activities

Requirements:

  • Minimum Bachelors degree in Engineering or Sciences (or related field). Masteror PhD holder ispreferred.
  • Good aptitude in statistical data analysis andproblem solving skills
  • Must exhibit pro-activeness in leading process characterization work ability to take on new challengesan embrace changes
  • Basic knowledge of project planning and experience in driving small projects
  • Excellent communication and presentation skills
  • Must demonstrate goodinitiative collaboration and interpersonal skills working with cross functional teams
  • Must be committedto meet process / project deadlines and commitments


More information about NXP in Malaysia...

#LI-633a

Required Experience:

IC


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NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.

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