Packaging Development Engineer

NXP Semiconductors

Job Location:

Kuala Lumpur - Malaysia

Monthly Salary: Not Disclosed

Posted on: 5 hours ago

Vacancies: 1 Vacancy

Job Summary

Responsibilities:

Lead plan andexecute projects related to processassembly development andvalidation
Design execute and analyze process related experiments
Use software to analyze data including statistical analysis
Solveprocess issues usingcreative problem solving techniques
Create process recipe for packaging development qualifyand transfer forhigh volume production
Set upnewspecifications and procedures for production
Initiate sharing of lesson learnt and best practices among manufacturing sites
Lead / participate in Task Force Teams
Identify risks and actions for risk mitigation manufacturing operation
Lead / support process qualification activities

Requirements:

Minimum Bachelors degree in Engineering or Sciences (or related field). Masteror PhD holder ispreferred.
Good aptitude in statistical data analysis andproblem solving skills
Must exhibit pro-activeness in leading process characterization work ability to take on new challengesan embrace changes
Basic knowledge of project planning and experience in driving small projects
Excellent communication and presentation skills
Must demonstrate goodinitiative collaboration and interpersonal skills working with cross functional teams
Must be committedto meet process / project deadlines and commitments

More information about NXP in Malaysia...

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Required Experience:

Responsibilities:Lead plan andexecute projects related to processassembly development andvalidationDesign execute and analyze process related experimentsUse software to analyze data including statistical analysisSolveprocess issues usingcreative problem solving techniquesCreate process recipe for pa...