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BGA WB Process Technician
Job Location:
Job Location:
Kuala Lumpur - Malaysia
Monthly Salary:
Not provided by the employer
Monthly Salary:
Posted:
25 August 2026 (12 days ago)
Posted:
Application Deadline:
22 November 2026
Application Deadline:
Vacancies:
1 Vacancy
Vacancies:
Job Summary
- Perform machine setup conversion and qualification for wire bond equipment.
- Monitor daily production performance and ensure compliance with process specifications.
- Support production activities to achieve output quality and delivery targets.
- Perform lot buy-off and process verification before production release.
- Monitor critical wire bond parameters and maintain process stability.
- Conduct routine process audits and inspections.
- Perform process characterization and parameter optimization activities.
- Analyze process data and identify trends affecting quality or yield.
- Troubleshoot wire bond defects and supports engineers for root cause analysis
- Support cost reduction and productivity enhancement initiatives.
#LI-DNI
Required Experience:
IC
About Company
NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
