Senior Principal Electrical Engineer

Primary Duties & Responsibilities

• Lead complete RF/microwave and high-speed mixed-signal hardware architecture for next-generation optical transceivers evaluation boards reference platforms and production test hardware.
• Design high-speed schematics and PCBAs for 100G/lane 200G/lane 400G/lane and beyond interconnects supporting 800G 1.6T 3.2T and future architectures where applicable.
• Own board-level tradeoffs for signal integrity power integrity EMI/EMC grounding return path control isolation thermal performance manufacturability serviceability cost reliability and schedule.
• Architect and design high-performance instrumentation used for validation characterization calibration automation manufacturing test and sustaining support of fiber optic transceiver modules.
• Select and qualify high-speed RF microwave analog precision measurement clocking DSP control sensing connector cable interconnect and power components.
• Define PCB stackups materials copper weights dielectric selection via structures backdrill strategy impedance targets loss budgets fabrication rules assembly constraints and acceptance criteria.
• Partner with SI/PI packaging optics firmware software mechanical thermal reliability manufacturing supply chain and operations teams to deliver complete product and test solutions.
• Lead schematic capture layout strategy layout review RF structure review BOM review DFM/DFT review design verification bring-up debug characterization and production release.
• Define digital control interfaces and hardware/firmware interaction requirements for CPLDs FPGAs microcontrollers DSPs drivers TIAs modulators lasers sensors ADCs DACs and power controllers.
• Develop validation plans test methods calibration approaches correlation methods guardband strategies and production screening methods for high-volume test environments.
• Perform hands-on lab measurements and debug using oscilloscopes VNAs spectrum analyzers BERTs pattern generators optical power meters optical spectrum analyzers thermal chambers power supplies SMUs and automated test systems.
• Lead design reviews risk reviews failure analysis root cause analysis corrective actions and lessons-learned across programs.
• Mentor senior and mid-level engineers; establish hardware design best practices checklists libraries reuse blocks and review criteria.
• Engage with suppliers and technical partners on advanced components connectors PCB materials laminates cable assemblies sockets fixtures and precision measurement technologies.
• Support critical customer discussions roadmap evaluations architecture tradeoffs and executive-level technical reviews as required.

Education & Experience

• 15 years of direct experience designing RF/microwave high-speed mixed-signal analog digital and precision measurement hardware.
• 15 years of hands-on schematic PCB layout guidance bring-up debug and verification experience for complex high-speed PCBAs.
• 15 years of experience designing or architecting test equipment validation hardware manufacturing test boards automation fixtures or instrumentation for high-performance electronics and/or optical communications.
• Deep knowledge of high-speed PCB design for very-low-loss channels including impedance control crosstalk skew return loss insertion loss via transitions connectors cable launches package breakout return current and reference plane management.
• Proven understanding of RF/microwave design practices including controlled impedance transmission lines RF launches baluns couplers filters attenuators terminations clock distribution shielding isolation and grounding.
• Expertise selecting PCB materials and stackups for high-frequency applications including Rogers Panasonic and equivalent low-loss laminate families hybrid stackups prepreg/core choices resin systems glass weave effects fabrication tolerances and cost/performance tradeoffs.
• Strong command of precision analog design including low-noise sensing voltage/current/temperature measurement ADC/DAC interfaces op amps references power monitoring calibration offset/gain error noise drift and thermal effects.
• Experience with optical module and networking ecosystems including OSFP QSFP-DD and earlier MSA form factors; familiarity with CPO XPO NPO and 3.2T-class architecture challenges is strongly preferred.
• Ability to evaluate high-speed ICs drivers TIAs DSPs retimers clocking devices power devices sensors controllers and RF/microwave components across major suppliers.
• Ability to create clear engineering documentation including architecture specifications schematics layout guidance design review packages validation plans test reports BOM rationale risk registers and manufacturing release documentation.
• Masters degree in Electrical Engineering Electronics Engineering Computer Engineering or related technical discipline; advanced degree preferred.

Skills

• High-speed serial links PAM4/NRZ concepts SerDes channel design equalization-aware hardware design eye/jitter/noise concepts and link budget thinking.
• SI/PI simulation literacy and ability to interpret S-parameters TDR/TDT channel operating margin power rail impedance decoupling strategy and package/connector/PCB interactions.
• RF/microwave interconnect knowledge including Amphenol Rosenberger Samtec Hirose Cinch SV Microwave HUBERSUHNER and equivalent connector/block ecosystems.
• Working knowledge of major precision analog/RF component suppliers such as ADI TI Skyworks Silicon Labs Z-Communications and equivalent suppliers.
• Working knowledge of DSP/high-speed processing ecosystems used in optical networking including Marvell Nvidia Broadcom and equivalent suppliers.
• Experience with EDA/CAD workflows such as Siemens/Mentor PADS Xpedition Cadence Allegro/OrCAD Altium or equivalent tools; ability to guide layout engineers at expert level.
• Experience with simulation and analysis tools such as CST HFSS ADS HyperLynx Sigrity Keysight PathWave MATLAB/Python or equivalent is preferred.
• Familiarity with test automation and data analysis using Python MATLAB LabVIEW C# C/C SCPI VISA or equivalent environments.
• Knowledge of fiber optics test and measurement equipment including BERTs sampling/real-time oscilloscopes VNAs spectrum analyzers optical spectrum analyzers optical power meters wavelength meters tunable lasers attenuators thermal control systems and automated handlers.
• Experience with DFM DFA DFT DVT EVT/PVT NPI sustaining engineering yield improvement supplier qualification ECOs failure analysis and production release processes.
• Strong technical leadership decision making communication and cross-functional influence in a fast-paced engineering environment.

• Candidate should be assessed through deep technical interview panels covering RF/MW design high-speed board architecture PCB material/stackup selection SI/PI optical transceiver standards test equipment design precision sensing supplier ecosystem knowledge and hands-on debug capability.
• Interviewers should validate depth with design walkthroughs failure-analysis examples board bring-up case studies instrument architecture examples and tradeoff discussions rather than relying solely on keyword matching.
• Expected level is immediate technical ownership. This is not intended as a developmental role requiring extended training before the person can lead designs.

Working Conditions

• Collaborative engineering environment involving office lab and manufacturing areas.
• Job requires hands-on laboratory work with high-speed electronic RF/microwave optical thermal and automated test equipment.
• On-site presence is expected for design bring-up lab validation production support and cross-functional reviews; hybrid work may be possible when compatible with project needs.
• Limited domestic and international travel may be required for supplier customer manufacturing or cross-site engineering engagements.
• Must be able to function in a fast-paced environment while managing multiple complex programs.

Physical Requirements

• Regular use of a computer and engineering software tools.
• Hands-on lab work including probing cabling fixture setup instrument configuration and PCBA handling.
• Ability to work in ESD-controlled areas and follow PPE requirements.
• Occasional lifting of lab equipment fixtures or materials up to 20 pounds.
• Ability to communicate verbally and in writing with internal and external technical stakeholders.

Safety Requirements

All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards.

• Role requires compliance with ESD procedures including ESD garments wrist straps grounding monitors and footwear where required.
• Managers will ensure safety and environmental procedures are followed consistently risk assessments are performed required training and work instructions are available and compliance is monitored.

Quality and Environmental Responsibilities

Depending on location this position may be responsible for the execution and maintenance of the ISO 9000 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System.

CultureCommitment

Ensure adherence to companys values (ICARE) in all aspects of your position at Coherent Corp.:

Integrity Create an Environment of Trust

Collaboration Innovate Through the Sharing of Ideas

Accountability Own the Process and the Outcome

Respect Recognize the Value in Everyone

Enthusiasm Find a Sense of Purpose in Work

Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex gender identity sexual orientation race color religion national origin disability protected Veteran status age or any other characteristic protected by law.