Principal Process Development Engineer ( Wire bond Package R&D)
Job Summary
As a Principal Process Development Engineer (WB) you will develop and optimize semiconductor assembly processes to meet project Functional Requirement Specifications (FRS) ensuring robust manufacturability reliability and high-quality output for new products and platforms.
What You Will Do
Develop and characterize new semiconductor process technologies applying structured engineering methods such as DOE SPC FMEA and Six Sigma
Drive end-to-end process development from concept to stable high-yield manufacturing solutions
Provide technical input for assembly processes and equipment solutions for new products and platforms
Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites
Apply wafer metallization knowledge to optimize process performance and stability
Conduct benchmarking and technology studies to support package roadmap and continuous improvement initiatives
Use statistical analysis tools (e.g. Minitab/Statistica) to analyze process performance and drive data-based decisions
Provide technical support for wire bond-related issues for both internal and external customers
Demonstrate technical leadership in cross-site problem solving and process improvement activities
Communicate effectively across teams ensuring clear technical alignment and fast response to manufacturing challenges
What You Will Need
Bachelors degree in engineering or an equivalent related field of study
At least 5 years of experience in semiconductor or manufacturing environment
Hands-on experience in FOL processes (wafer dicing die bond plasma wire bond AOI)
Strong knowledge of wire bond packaging technologies
Experience applying Six Sigma methodologies and statistical tools (DOE SPC FMEA 8D Minitab/Statistica)
Strong analytical problem-solving and data interpretation skills
Good communication skills in fluent English
Strong teamwork interpersonal skills and ability to work across functions and sites
Strong ownership responsiveness and ability to handle customer or production issues effectively
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.
D&I Statement
As an equal-opportunity employer Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all and we consider all applicants fairly as well as providing a safe work environment and reasonable adjustments where requested.
In addition we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Womens groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
Required Experience:
Staff IC
About Company
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.