Principal Process Development Engineer (Die Attach Package R&D)

Nexperia

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profile Job Location:

Seremban - Malaysia

profile Monthly Salary: Not Disclosed
Posted on: 13 hours ago
Vacancies: 1 Vacancy

Job Summary

As a Principal Process Development Engineer you will be responsible for die attach (DA) process development in an R&D environment ensuring robust manufacturability and meeting project Functional Requirement Specifications (FRS). You will support next-generation semiconductor packaging development from concept to production readiness.

What You Will Do

  • Develop and characterize new die attach process technologies

  • Lead technical discussions and ensure effective communication within project teams focusing on die attach (DA) topics

  • Provide technical input for assembly processes and equipment solutions for new products and platforms

  • Optimize wafer metallization processes by applying strong wafer-level technical understanding

  • Develop robust manufacturing solutions to ensure package reliability and process stability

  • Provide technical support for die attach (DA) issues for both internal and external customers

  • Conduct competitor benchmarking and technology studies to support package roadmap development

  • Drive cross-site technical problem solving and process improvement initiatives

  • Demonstrate technical leadership in resolving process challenges across global teams

What You Will Need

  • Bachelors degree in engineering or a related discipline

  • Minimum 5 years of experience in semiconductor manufacturing environment

  • Hands-on experience in die attach processes (eutectic epoxy DAF)

  • Strong knowledge of FOL processes including die bond wire bond and AOI

  • Experience in applying Six Sigma methodologies and statistical tools (DOE SPC FMEA 8D Minitab/Statistica)

  • Strong analytical and problem-solving skills with data-driven mindset

  • Good communication skills with fluent English

  • Strong teamwork interpersonal skills and ability to work in cross-functional teams

  • Strong ownership and responsiveness to internal and external customer needs

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all and we consider all applicants fairly as well as providing a safe work environment and reasonable adjustments where requested.

In addition we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Womens groups. Nexperia is committed to increasing women in management positions to 30% by 2030.


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As a Principal Process Development Engineer you will be responsible for die attach (DA) process development in an R&D environment ensuring robust manufacturability and meeting project Functional Requirement Specifications (FRS). You will support next-generation semiconductor packaging development fr...
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About Company

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Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.

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