Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer

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Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity sustainability and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Job Description

As a Global Quality (GQ) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer on the DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA) at Micron Technology Inc. you will be responsible for the electrical characterization and electrical failure analysis (EFA) of all HBM products. You will need to distinguish whether it is package or device related failures. Preferably you are equipped with knowledge of DRAM functionality process test program and device necessary for making solid judgment. You will also use a variety of test tools including the uMate tester Merlin Mongoose SM3 Prober CAD layout tool and a variety of technical drawings and schematics to perform detailed characterization on HBM products. You will record and categorize failures in order to determine failure mechanisms and this role you will communicate with various engineering groups assist lab users with equipment setup and interpretation of data and maintain critical EFA knowledge database. You will also be expected to seek ways to improve the EFA process in order to reduce test time increase throughput and increase failure mechanism assignment accuracy and consistency.

You will:

Analyze Failed Components from Reliability Testing

• Interpret historical tests results
• Adjust timing/level/testmode/code/temp to find out the sensitivities of failures for array fails
• Perform visual inspection to identify physical defects
• Utilize schematics/layouts/process to recognize abnormalities
• Document failed conditions and test results
• Categorize electrical failures
• Communicate results
• Coordinate next level analysis to various groups including PYE (Product Yield Enhancement) for CSAM (C-mode scanning acoustic microscope)/functional open (FO)/PFA (Physical Failure Analysis) Product Engineering and Package Reliability.
• Identify and communicate new or unusual results (electrical signals)

Respond to Equipment Issues

• Understand test software and hardware configurations
• Troubleshoot hardware issues
• Identify and report software and hardware issues
• Repair or coordinate repair of equipment
• Configure and upgrade test equipment
• Develop and deploy failure analysis (FA) software

Provide Technical Support and Conduct Training

• Assist lab users with equipment setup
• Teach operation of equipment
• Conduct on-the-job training (OJT) for new hires and transfers
• Provide data interpretation
• Suggest failure root cause
• Provide suggestions for further analysis
• Introduce new users to basic DRAM functionality/process/device

Perform Engineering Requests and Supplemental Tasks

• Submit package level physical failure analysis (PFA)
• Provide FA for other groups as requested (RMA Module)
• Determine engineering test requirements
• Execute request and experiments
• Summarize test results and provide feedback
• Create repair converters

Manage Failure Analysis (FA) Information

• Create and maintain specific FA database
• Track FA data
• Identify false failures
• Analyze and summarize data

Perform Quality/Reliability request and review

• Perform review on test time reduction requests
• Perform review on Design/Marketing datasheet requests
• Perform review on Modify Qual requests
• Perform review on Material Review Board (MRB)
• Perform review on Process of Record Review Board (PORRB)
• Perform review on customer reports/data

Education:

• Required: Bachelors degree in Electrical / Electronics/ Computer Engineering
• Desired: Masters Degree in Electrical / Electronics/ Computer Engineering

Required Qualifications:

• 5 years of experience in semiconductor field
• Knowledge of DRAM operation fabrication process and semiconductor device physics
• Familiarity with failure analysis troubleshooting/debugging advanced packaging wafer testing component testing and module testing concept and flow.
• Strong troubleshooting skill
• Good organizational skills and sharp attention to detail
• Good written and oral communication skills
• Efficient computer skills
• Knowledge of the DRAM fabrication process/test program/functionality
• Familiarity with Unix DFII/Cadence and/or uMate preferred
• Ability to work independently or in a group environment
• Basic understanding of electrical equipment
• Ability to use the analytical tools provided on the various test equipment such as uMate Curve Tracer or Oscilloscope

About Micron Technology Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.

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