Principal Engineer-Package Design

Key Responsibilities

• Package Design & Development:
  • Lead the design and development of new MOSFET packages especially for lead frame based (e.g. DFN).
  • Lead frame and clip frame design experience is preferred.
  • Create detailed package models using 3D CAD software and define all critical dimensions material stack-ups and assembly drawings.
  • Optimize package designs for superior electrical performance (low RDS(on) low parasitic inductance/capacitance) thermal performance (low RthJC) and mechanical robustness.
• Simulation & Analysis:
  • Perform multi-physics simulations including thermal (e.g. Ansys Icepak SolidWorks Simulation) electrical (e.g. Q3D Extractor HFSS) and mechanical stress analysis to predict and validate package performance.
  • Analyze simulation results to identify design trade-offs and drive design improvements.
  • Correlate simulation models with empirical data from lab characterization to ensure accuracy.
• Material Selection & Qualification:
  • Evaluate and select packaging materials including leadframes mold compounds die-attach materials and bonding wires to optimize performance reliability and cost.
  • Work with suppliers to qualify new materials and processes.
• Cross-Functional Collaboration:
  • Collaborate closely with silicon design test engineering product engineering and reliability teams to ensure package designs meet all product specifications.
  • Partner with PE and EE to develop robust manufacturing processes troubleshoot yield issues and ensure smooth new product introductions.
  • Interface with application engineers to understand customer requirements and translate them into package design criteria.
• Documentation & Process Improvement:
  • Maintain comprehensive design documentation including specifications simulation reports and assembly procedures.
  • Contribute to the development of internal design rules guidelines and best practices for package engineering.
  • Stay current with industry trends emerging packaging technologies and competitive landscape.

Required Qualifications

• Education:Bachelor of Science (B.S.) in Mechanical Engineering Electrical Engineering Materials Science or a related field. A Master of Science (M.S.) is highly preferred.
• Experience:
  • 5 years of direct experience in semiconductor package development with a strong focus onpower devices (MOSFETs or IGBTs).
  • Proven track record of successfully taking packages from concept through design simulation and high-volume manufacturing.
• Technical Skills:
  • Proficiency in 3D CAD software (e.g. AutoCAD SolidWorks Creo).
  • Strong understanding of semiconductor packaging processes including die attach wire bonding and molding.
  • Deep knowledge of power semiconductor physics including thermal management parasitics and failure mechanisms.
  • Familiarity with reliability testing standards and methodologies (e.g. JEDEC AEC-Q101) for automotive and industrial applications.

Come join our global inclusive & diverse team

Our purpose is to improve the quality of life of everyone we touch through our innovative motion systems. We are a truly global team bound together by our shared values. Our culture is built on the diversity knowledge skills creativity and talents that each employee brings to the company. Our people are our companys most valuable asset. We are committed to providing an inclusive diverse and equitable workplace where employees of different backgrounds feel valued and respected regardless of their age gender race ethnicity or religious background. We are committed to inspiring our employees to grow act with ownership and find fulfilment and meaning in the work they do.

欢迎加入我们全球性富包容和多元化的团队

我们的目标是通过创新的驱动系统提高每一个产品接触者的生活质量我们是一个真正的全球性团队我们有着共同的价值观因而联结在一起我们的文化是建基于每一位员工为公司带来的多样性知识技能创意和才能之上我们的员工是我们企业最宝贵的资产我们致力于为员工提供一个包容多元和平等的工作场所在这里无论他们的年龄性别肤色种族或宗教信仰如何不同背景的员工都能感到受重视和尊重我们致力于激励我们的员工成长以主人翁精神行事并在他们所做的工作中找到成就感和意义