Process Engineer – Die to Wafer Hybrid Bonding

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Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology join us to deliver material innovation that changes the world.

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Join the Photonics Platforms Business Group within the CTO Office at Applied Materials Santa Clara headquarters where you will work with a worldclass research team developing nextgeneration optical interconnects technologies.

We are seeking handson Process Engineers to drive dietowafer (D2W) hybrid bonding R&D for silicon photonics and copackaged optics applications. This role focuses on hybrid bonding process development pathfinding technology derisking and integration exploration.

The engineer will develop and evaluate novel bonding flows enabling photonicelectronic cointegration a critical enabler for AI and HPC systems. The role provides onthejob training and handson experience with stateoftheart equipment including the industrys first fully integrated dietowafer hybrid bonding system.

Key Responsibilities

• Develop dietowafer hybrid bonding processes including (but not limited to):
  • Surface preparation and plasma activation
  • Highaccuracy die placement and alignment
  • Postbond characterization and process evaluation
• Integrate D2W bonding with adjacent process modules such as:
  • Dicing and die preparation
  • Die thinning
  • Interdie gap fill and planarization
• Design and execute DOEdriven experiments to understand process limits sensitivities and tradeoffs.
• Own process optimization perform failure analysis and characterization and drive continuous engineering improvement.

Qualifications

• M.S. or Ph.D. in Materials Science Electrical Engineering Applied Physics or a related STEM discipline.
• Indepth knowledge and handson experience in one or more of the following:
  • Dietowafer or wafertowafer bonding
  • Thindie handling and alignmentcritical processes
  • Direct process engineer experience on mainstream semiconductor equipment (plasma wet clean overlay/alignment etc.)
  • 2.5D/3D integration
• Strong understanding of:
  • Bond interface physics
  • Alignment and overlay fundamentals
  • Mechanical behavior of thin and fragile dies
• Proficiency in statistical analysis and process control (e.g. DOE SPC JMP).
• Selfstarter with strong problemsolving skills; able to work both independently and collaboratively with minimal supervision.
• Strong communication and interpersonal skills with the ability to collaborate effectively across multidisciplinary teams.

Additional Information

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The salary offered to a selected candidate will be based on multiple factors including location hire grade job-related knowledge skills experience and with consideration of internal equity of our current team addition to a comprehensive benefits package candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program as applicable.

For all sales roles the posted salary range is the Target Total Cash (TTC) range for the role which is the sum of base salary and target bonus amount at 100% goal achievement.

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