Senior Director, Advanced Packaging Disruptive Technology

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology join us to deliver material innovation that changes the world.

What We Offer

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The Senior Director Principal MTS is a senior technical leader responsible for defining and driving panel scaling technology strategy and customer-facing execution across next-generation advanced packaging and substrate platforms. This role leads cross-functional alignment to accelerate panel-level form factor scaling RDL scaling and ecosystem readinessconnecting customer needs to integrated equipment/process solutions and strategic partnerships.

This position operates at the intersection of technology roadmaps account strategy and disruptive pathfinding translating panel scaling inflections into executable customer engagements demo programs and internal investment priorities.

Key Responsibilities

Panel Scaling Technology Strategy & Roadmap Ownership :

Own the panel scaling technology roadmap across form factor scaling interconnect scaling and substrate scaling including transitions from wafer-based approaches to panel-based architectures.

Define technology inflections and integration milestones for advanced panel build-up and align internal roadmaps to customer adoption cycle

Ecosystem & Partnership Development

Build and manage a partner ecosystem spanning substrate makers material suppliers OSATs foundries and research institutes to close panel scaling gaps (design rules warpage overlay defectivity metrology/inspection reliability).

Identify evaluate and activate disruptive partners and collaborations to accelerate panel readiness and strengthen differentiation.

Program Governance & Executive Communication

o Lead executive-ready storytelling and decision frameworks

o Drive internal alignment across engineering product lines marketing and finance on portfolio gaps and priorities required to lead in advanced panel packaging.

Resolves exceptionally complex field process issues utilizing systematic troubleshooting methodology generally involving multiple processes. Create a mechanism to communicate issues track progress and pull resources from multiple divisions and/or functions. Uses sound statistical techniques like and problem solving methodologies DOEs (Design of Experiment) to quickly determine root cause and action plans. Communicates learnings from this portion to rest-of-world to strengthen the product packages.

Serves as the customer expert across a broad range of exceptionally complex products. Plays a key role in defining product strategy and identifying gaps. Provides feedback to division heads on process and hardware improvements to meet customer roadmap requirements.

Directs the positioning of new technologies to customers utilizing technical information from divisions. Interfaces with customers at key development and manufacturing sites to form strategic partnerships to evaluate new and emerging technologies and oversees joint development activities or beta-site testing programs. Makes senior executive level presentations.

Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.

Functional Knowledge

Demonstrates broad and comprehensive understanding of different systems theories and practices regarding advanced packaging as well as the changing business environment

Business Expertise

Applies in-depth advanced packaging knowledge business and commercial expertise to differentiate itself from the competition

Leadership

Visionary Business & Technology Leader: Shapes strategy at the intersection of advanced technology and customer value turning complex challenges into scalable marketleading solutions.

Trusted Executive Partner: Builds credibility with Csuite leaders customers and partners through clear communication strong judgment and a collaborative leadership style.

Decisive Change Agent: Thrives in fastpaced ambiguous environmentsdriving alignment making highimpact decisions and delivering results.

PeopleFirst Leader: Inspires and develops worldclass teams fostering a culture of innovation accountability and continuous growth.

Problem Solving

Evaluates key business challenges; directs the development of new or innovative solutions

Impact

Guided by company strategy and business objectives impacts results of segment/function

Interpersonal Skills

Influences and negotiates at the top executive levels with great latitude on

outcomes; presents and defends complicated or delicate issues

Core Qualifications

15 years experience in semiconductor packaging substrates panel processing lithography/patterning deposition/etch or adjacent advanced manufacturing domains.

Demonstrated leadership in technology strategy customer execution (principal-level account leadership platform adoption or roadmap ownership).

Strong working knowledge of advanced packaging drivers: panel form factor scaling RDL scaling TGV/glass & organic substrate trends and manufacturing/yield constraints at large format

Proven ability to lead cross-functional organizations and influence without direct authority across engineering product teams and external partners.

Executive communication strength: translating complex technical tradeoffs into business outcomes and decisions.

Preferred Qualifications

PhD/MS in Materials Science Electrical Engineering Mechanical Engineering Chemical Engineering Physics or equivalent experience.

Prior experience launching new platforms (e.g. panel-based process modules integrated packaging lines or disruptive substrate architectures

Demonstrated track record of ecosystem building (materials substrate suppliers research institutes foundries/OSATs)

Travel

Travel as needed for strategic customer engagements partner meetings and industry/consortia events.

Additional Information

Time Type:

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Travel:

Relocation Eligible:

The salary offered to a selected candidate will be based on multiple factors including location hire grade job-related knowledge skills experience and with consideration of internal equity of our current team addition to a comprehensive benefits package candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program as applicable.

For all sales roles the posted salary range is the Target Total Cash (TTC) range for the role which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.

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